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个人简介
SPECIALIZED PROFESSIONAL COMPETENCE
Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, MEMS, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability.
Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, MEMS, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability.
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论文共 362 篇作者统计合作学者相似作者
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Journal of Electronic Packagingpp.1-16, (2024)
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu,Y. H. Chen, Tzyy-Jang Tseng,Ming Li
JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2024)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 376-396
JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)
IEEE transactions on components, packaging, and manufacturing technologyno. 3 (2023): 399-425
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.542-547, (2023)
John H. Lau,Curry Lin,Hsing-Ning Liu,Kai-Ming Yang,Tim Xia,Cheng-Ta Ko,Bruce Puru Lin, Yu-Ling Chuang,R. Chen, M. Ma,Tzyy-Jang Tseng,Ming Li,K. Leung
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1371-1379
Proceedings of the International Symposium on Microelectronicsno. Issue 1 (2023)
Channing Cheng-Lin Yang,John H. Lau,Gary Chang-Fu Chen, Joe Huang, Andy Peng,Hsing-Ning Liu,Y-H. Chen,Tzyy-Jang Tseng
IMAPS symposia and conferencesno. Issue 1 (2023)
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作者统计
#Papers: 357
#Citation: 7783
H-Index: 44
G-Index: 70
Sociability: 7
Diversity: 1
Activity: 2
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