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个人简介
Kun Ma received the B.S. degree in mechanical engineering from the North University of Water Resources and Electric Power, Zhengzhou, China, in 2018, and the M.S. degree in mechanical engineering from Wuhan University, Wuhan, China, in 2020, where he is currently pursuing the PhD degree in mechanical and electronic engineering.
His current research interests include high-temperature packaging of power semiconductor devices and processing of nanoscale materials for power electronics packaging development.
研究兴趣
论文共 13 篇作者统计合作学者相似作者
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Kun Ma,Yameng Sun,Xun Liu,Yifan Song, Xuehan Li, Huimin Shi,Zheng Feng, Xiao Zhang,Yang Zhou,Sheng Liu
Sensors (Basel, Switzerland)no. 9 (2024): 2858
Engineering Failure Analysis (2023): 106824-106824
Micromachinesno. 1695 (2023): 1695-1695
Materials (Basel, Switzerland)no. 12 (2023): 4472-4472
Zhiwen Chen,Kun Ma,Li Liu,Ning-Cheng Lee,Guoyou Liu, Jiasheng Yan,Hui Li,Sheng Liu,Meng Ruan,Huiming Pan, Wenli Lu,Jiaqi Ding
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 7 (2021): 1081-1087
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