Lei YeSchool of Material Science and Engineering Shanghai Jiao Tong University关注立即认领分享关注立即认领分享基本信息浏览量:5职业迁徙个人简介暂无内容研究兴趣论文共 3 篇作者统计合作学者相似作者按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选时间引用量主题期刊级别合作者合作机构Influence of aging temperature and time on the intermetallic reaction in 15μm Cu/Sn copper pillar bumpLei Ye,Chao Huang,Huiqin Ling,Anmin Hu,Ming Li2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)(2018)引用1浏览0EIWOS引用10Effects of reduced graphene oxide film on bonding interfaces between Cu microcones and 25 μm Sn/Cu bumps Longlong Ju,Menglong Sun,Lei Ye, Liangzhao Zhang,Anmin Hu,Ming LiJ Mater Sci: Mater Electron(2017)引用1浏览0引用10Wettability evolution of different nanostructured cobalt films based on electrodeposition Longlong Ju,Han Xiao,Lei Ye,Anmin Hu,Ming LiMicro & Nano Letters(2017)引用6浏览0EIWOS引用60作者统计合作学者合作机构D-Core合作者学生导师暂无相似学者,你可以通过学者研究领域进行搜索筛选数据免责声明页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn