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个人简介
Luhua Xu received the B.S. and M.S. degrees in materials science and engineering from Tsinghua University, Beijing, China, in 2000 and 2002, respectively, and is currently pursuing the Ph.D. degree in mechanical and aerospace engineering at Nanyang Technological University, Singapore.
He concentrates on lead-free solder joint reliability and failure analysis of product level electronic products; such as intermetallic growth and solid reaction subject to thermal cycling and electromigration; drop impact reliability of packaging. He used digital image speckle analysis to find the strain concentration in BGA solder joint, and now is using nanoindentation CSM to characterize materials properties in packaging.
研究兴趣
论文共 111 篇作者统计合作学者相似作者
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Journal of Southwest Forestry Universityno. 5 (2018): 132-138
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#Papers: 111
#Citation: 633
H-Index: 17
G-Index: 21
Sociability: 5
Diversity: 3
Activity: 0
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