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职业迁徙
个人简介
Maximilian Schmid received the M.Sc. degree in electrical engineering from the Technische Hochschule Ingolstadt (THI), Ingolstadt, Germany, in 2014 and 2016, respectively, where he is currently pursuing the Ph.D. degree in microelectronic packaging in cooperation with Technische Universität Berlin, Berlin, Germany.
He is currently an Assistant Researcher with THI.
研究兴趣
论文共 38 篇作者统计合作学者相似作者
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2024)
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINICpp.1-6, (2023)
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (2022)
2022 28TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2022) (2022)
Sri Krishna Bhogaraju,Maximilian Schmid,E. Liu,Rodolfo Saccon,Gordon Elger, Holger Klassen, Klaus Muller, Georg Pirzer
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1720-1725, (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-6, (2022)
International Workshop on Thermal Investigations of ICs and Systemspp.1-6, (2022)
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (2022)
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作者统计
#Papers: 38
#Citation: 250
H-Index: 10
G-Index: 15
Sociability: 3
Diversity: 2
Activity: 8
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