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Myungguk Lee received the B.S. degree in electronic engineering from the Kumoh National Institute of Technology, Gumi, South Korea, in 2015, and the M.S. degree in electrical engineering from the Pohang University of Science and Technology, Pohang, South Korea, in 2017, where he is currently pursuing the Ph.D. degree.
His current research interests include high-speed I/O and 3-D interposer integration.
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IEEE Journal of Solid-State Circuitsno. 99 (2024): 1-11
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSno. 1 (2024): 373-382
IEEE Transactions on Circuits and Systems I: Regular Papersno. 1 (2023): 373-382
2022 IEEE International Solid- State Circuits Conference (ISSCC) (2022): 1-3
2022 IEEE International Solid- State Circuits Conference (ISSCC) (2022): 450-452
2022 19th International SoC Design Conference (ISOCC)pp.19-20, (2022)
asian solid state circuits conferencepp.209-212, (2018)
2018 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC): PROCEEDINGS OF TECHNICAL PAPERSpp.209-212, (2018)
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