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Dr. Tummala received many academic, industry and professional society awards including “Industry Week’s” one of the 50 stars in the U.S. for improving U.S. competitiveness, the David Sarnoff Award, the Third Millennium Award from IEEE, Daniel Hughes and John Wagnon's Award from IMAPS, Materials Engineering Achievement Award from ASM-International, the John Jeppson Award from American Ceramic Society, the Total Excellence Award in Electronics Manufacturing (TEEM) Award from the Society of Manufacturing Engineers, and the European Materials Award from DVM. He also received the Distinguished Alumni Award from the University of Illinois and the Indian Institute of Science, Bangalore, India. Most recently, he received the highest faculty award, the Distinguished Faculty Award from Georgia Tech. He has published over 320 technical papers, holds 71 U.S. patents and inventions, and authored the first modern reference book for microsystems packaging in 1988, and the first undergraduate textbook in 2001. He is a fellow of the IEEE, IMAPS, and the American Ceramic Society; a member of the National Academy of Engineering, and was the President of the IEEE-CPMT Society and IMAPS Society. He is a consultant to many of the Fortune 500 electronics companies in the U.S., Europe and Asia.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2023): 291-299
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.147-151, (2023)
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Polymersno. 19 (2023): 3895-3895
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2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1603-1608, (2023)
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.2168-2173, (2022)
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.2168-2173, (2022)
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