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个人简介
Ryan Lewis received the B.A. degree in physics from Whitman College, Walla Walla, WA, USA, in 2008, and the M.S. and Ph.D. degrees in mechanical engineering from the University of Colorado, Boulder, CO, USA, in 2010 and 2012, respectively. He currently holds a post-doctoral position with the University of Colorado at Boulder, developing hermetic encapsulation methods for flexible device technology. His research interests include micro fluidics for electronic cooling applications, ALD-based encapsulation methods, and MEMS for thermal management.
研究兴趣
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.264-270, (2021)
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作者统计
#Papers: 25
#Citation: 359
H-Index: 10
G-Index: 18
Sociability: 4
Diversity: 2
Activity: 0
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