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个人简介
Seong-Ho Seok received the bachelor’s and master’s degrees in material engineering from Yonsei University, Seoul, South Korea, in 2003 and 2005, respectively, and the Ph.D. degree in metallurgical engineering from Tohoku University, Sendai, Japan, in 2009.
He was Post-Doctoral Researcher in high-temperature modeling with the Institute of Energy Process Engineering and Chemical Engineering (IEC), Freiberg, Germany, and from 2010 to 2013, he was a Research Engineer with the Research Institute of Industrial Science and Technology (RIST), Pohang, South Korea. He joined the Corning Technology Center Korea, Corning Inc., Asan, South Korea, in 2013. His current research interests include through glass via (TGV) substrate fabrication and metallization process design on glass/ceramic substrates for electronic applications.
研究兴趣
论文共 9 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 437-444
Lars Brusberg,Jason R. Grenier,Aramais R. Zakharian,Lucas W. Yeary,Seong-Ho Seok,Jung-Hyun Noh,Young-Gon Kim, Jürgen Matthies,Chad C. Terwilliger, Barry J. Paddock,Robert A. Bellman, Daniel W. Levesque,
IEEE Journal of Selected Topics in Quantum Electronicsno. 3: Photon. Elec. Co-Inte. and Adv. Trans. Print. (2023): 1-10
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.492-497, (2023)
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IEEE Microwave and Wireless Technology Lettersno. 10 (2023): 1415-1418
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2021 51st European Microwave Conference (EuMC)pp.441-444, (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2022): 1432-1445
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2272-2278, (2021)
Chenggang Zhuang, Yan Wang,Ling Cai, Jody Markley, Heather Vanselous,Nikolay Zhelev,Seong-Ho Seok, Lanrik Kester, Michael Badding
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Cheolbok Kim,Cheng-Gang Zhuang,Nikolay Z Zhelev,Hoon Kim, Willam Bouton, Kristopher Wieland,Seong-ho Seok, Michael E Badding
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