基本信息
浏览量:0
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
个人简介
Seonghi Lee received the B.S. degree from the Korea University of Technology and Education (KoreaTech), Cheonan, South Korea, in 2020, and the M.S. degree from the Cho Chun Shik Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2020. He is currently pursuing the Ph.D. degree with KAIST.
His research interests include signal integrity (SI) and power integrity (PI) design and analysis of high-speed channels with machine learning.
研究兴趣
论文共 12 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.147-152, (2023)
引用0浏览0EIWOS引用
0
0
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.131-136, (2023)
引用0浏览0EIWOS引用
0
0
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 5 (2023): 700-714
Hyunwoong Kim,Seonghi Lee,Dongryul Park, Jungil Son, Yongho Lee, Sungwook Moon,Jiseong Kim,Seungyoung Ahn
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2022)
2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)pp.34-34, (2022)
2021 IEEE Wireless Power Transfer Conference (WPTC)pp.1-4, (2021)
Seonghi Lee,Hyunwoong Kim,Kyunghwan Song,Jongwook Kim, Dongryul Park, Jangyong Ahn,Keunwoo Kim,Seungyoung Ahn
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn