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论文共 52 篇作者统计合作学者相似作者
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.585-589, (2023)
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Qianwen Chen,Michael Belyansky,Yasir Sulehria,Akihiro Horibe, Liqiao Qin,Ruturaj Pujari,Eric Perfecto,Fee Li Lie,Shahid Butt, Nick Polomoff,Risa Miyazawa,Sayuri Kohara,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1175-1180, (2023)
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2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTMpp.1-3, (2023)
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2023)
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-8, (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-9, (2022)
Akihiro Horibe,Takahito Watanabe,Chinami Marushima,Hiroyuki Mori,Sayuri Kohara,Roy Yu,Marc Bergendahl, Teddie Magbitang,Rudy Wojtecki,Divya Taneja, Maxime Godard, Claudia Cristina Barrera Pulido,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.625-630, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.631-634, (2022)
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)pp.207-208, (2022)
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.586-590, (2022)
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