基本信息
浏览量:0
职业迁徙
个人简介
Usman Chaudhry received the B.S. degree in Mechanical Engineering from Georgia Institute of Technology in 2002, and the M.S. degree in Packaging of Electronic devices from Southern Methodist University in 2006. He manages the High Voltage, Isolation and System in Package Modules group in the Semiconductor Packaging organization at Texas Instruments. He has over 10 years' experience working in the Semiconductor Packaging field covering various Wirebond, Flip Chip and System in Package technologies.
研究兴趣
论文共 5 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Jie Chen,Rajen Murugan,Steven Kummerl,Usman Chaudhry, Edwin Lim, Tatsuhiro Shimizu, Thatcher Klumpp, Jack Grantham
International Symposium on Microelectronicsno. 1 (2018): 000193-000197
International Symposium on Microelectronicsno. 1 (2018): 000326-000330
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)pp.1-11, (2016)
2016 INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM) (2016)
引用0浏览0引用
0
0
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn