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Utkarsh Mehrotra (Graduate Student Member, IEEE) received the B.Tech. degree in electrical engineering from the Manipal Institute of Technology, Manipal, India, in 2017. He is currently pursuing the Ph.D. degree with North Carolina State University, Raleigh, NC, USA.
He is affiliated with the FREEDM Systems Center, Raleigh, and is currently a Research Assistant with the PowerAmerica and the Packaging Research in Electronic Energy Systems (PREES) Laboratory under its director, Dr. Douglas C. Hopkins. His research interests include the design, simulation, fabrication, and testing of power electronics packaging topologies that harness the capabilities of wide bandgap (WBG) semiconductor technology (GaN and SiC), with a focus on solid-state circuit protection and their controls, power converters, and high-voltage high-density power modules scalable to 25-kV voltage range.
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IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICSno. 6 (2023): 5853-5862
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)pp.2351-2356, (2021)
2021 IEEE Energy Conversion Congress and Exposition (ECCE)pp.568-575, (2021)
International Symposium on Microelectronicsno. 1 (2021): 000260-000264
2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)pp.107-111, (2021)
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)pp.2251-2257, (2021)
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