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Bio
Dr. Valeriy Sukharev is the Siemens EDA Chief Scientist, Fremont, CA (former Mentor Graphics Corporation), which he joined in 2008 as part of the Ponte Solutions acquisition, where he was the Chief Scientist. He received an M.S. degree in solid-state physics from the Moscow Institute of Electronic Technology, Russia, and his Ph.D. degree in physical chemistry from the Karpov Institute of Physical Chemistry, Moscow, Russia. He has held various academic positions at the Karpov Institute of Physical Chemistry. He was a Visiting Professor with Brown University, Providence, RI, and a Guest Researcher with NIST, Gaithersburg, MD. He has authored/co-authored more than 140 publications in scientific journals and conference proceedings and holds 20 plus U.S. patents. He has co-edited 2 books and co-authored two. His major research activity is development of new full-chip modeling and simulation capabilities for the semiconductor processing and DFM/DFR applications.
Research Interests
Papers共 163 篇Author StatisticsCo-AuthorSimilar Experts
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J. Shuster-Passage, S. Abdel Razek, M. Mattoo,Meike Hauschildt,Seungman Choi,Martin Gall,Armen Kteyan,Jun-Ho Choy,Valeriy Sukharev,Matthias Kraatz, J. R. Lloyd
IEEE International Reliability Physics Symposiumpp.10A.4-1-10A.4-6, (2024)
ISPD '24: Proceedings of the 2024 International Symposium on Physical Designpp.85-90, (2024)
IEEE International Reliability Physics Symposiumpp.1-6, (2024)
IEEE International Reliability Physics Symposiumpp.1-10, (2024)
Armen Kteyan,Valeriy Sukharev, Alexander Volkov,Jun-Ho Choy,Farid N. Najm,Yong Hyeon Yi,Chris H. Kim,Stephane Moreau
ISPD '23: Proceedings of the 2023 International Symposium on Physical Designpp.124-132, (2023)
ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.127-202, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.34-79, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.338-379, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.80-126, (2022)
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