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Xing Qiu received the Ph.D. degree from the Hong Kong University of Science and Technology (HKUST) in 2020. He worked as a Research Staff with the Chinese University of Hong Kong (CUHK) from 2013 to 2014, where he worked on Bio-MEMS devices. He joined EPACK Laboratory since 2014, starting the Ph.D. research with developing additive manufacturing processes for electronic packaging applications. He is currently the Senior Technical Officer of Electronic Packaging Laboratory (EPACK Lab), HKUST. His current research interests include UVC LED packaging for sterilization, high-performance coil for implantable devices, high-performance on-chip coil, and additive maunfacturing for chip level packaging. He was granted the IEEE EPS Japan Chapter Young Award in 2019 (four recipients) and IPC Dieter Bergman Scholarship also in 2019.
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IEEE Electron Device Lettersno. 3 (2023): 504-507
JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2023)
2023 IEEE CPMT Symposium Japan (ICSJ)pp.21-24, (2023)
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2023 International Conference on Electronics Packaging (ICEP)pp.135-136, (2023)
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2022)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2022)
2021 International Conference on Electronics Packaging (ICEP)pp.153-154, (2021)
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