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个人简介
Yu-Ting Cheng was born in Taiwan, Republic of China. He received the B.S. and M.S. degrees in materials science and engineering from the National Tsing Hua University, Hsinchu, Taiwan, in 1991 and 1993, respectively, the M.S. degree in the field at Carnegie Mellon University, Pittsburgh, PA, in 1996, and the Ph.D. degree in electrical engineering at the University of Michigan, Ann Arbor, in 2000. His thesis was the development of a novel vacuum packaging technique for MEMS applications.
His research interests include the fundamental study of materials for MEMS applications, micropackaging and new hybrid micromachining fabrication of microstructures, microsensors, and microactuators. Now he is currently working for IBM Watson Research Center, Yorktown Heights, as a research staff member and involving in several SOP (System on Packaging) projects.
Dr. Cheng is a Member of Phi Tau Phi.
研究兴趣
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#Papers: 19
#Citation: 613
H-Index: 9
G-Index: 16
Sociability: 4
Diversity: 2
Activity: 3
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