基本信息
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Career Trajectory
Bio
Yakun Zhang received the B.E. degree in mechanical design, manufacturing, and automation from the North China Institute of Aerospace Engineering, Langfang, China, in 2019. She is currently working toward the M.E. degree with the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China.
Her current research interests include reliability of power semiconductor device, thermomechanical modeling.
Research Interests
Papers共 11 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2024)
2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.01-05, (2024)
IEEE Transactions on Device and Materials Reliabilityno. 4 (2023): 444-452
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
2023 IEEE Energy Conversion Congress and Exposition (ECCE)pp.2783-2788, (2023)
Journal of electronic materialsno. 3 (2023): 1360-1373
Guoping Lv,Haidong Yan,Siliang He,Daoguo Yang,Xinke Wu,Kuang Sheng, Chaohui Liu,Yakun Zhang,Guoqi Zhang
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2022)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022)
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Author Statistics
#Papers: 9
#Citation: 7
H-Index: 1
G-Index: 2
Sociability: 3
Diversity: 0
Activity: 1
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