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个人简介
Zichen Zhang (Student Member, IEEE) was born in Urumqi, China. He received the B.S. degree in physics from the Peking University, Beijing, China, in 2017, and the M.S. degree in electrical engineering from the Stony Brook University, Stony Brook, NY, USA, in 2018. He is currently working toward the Ph.D. degree in electrical engineering with the Virginia Tech, Blacksburg, VA, USA.
His research interests include high-density packaging of WBG power devices/modules and the evaluation of insulation materials for medium-voltage power modules.
研究兴趣
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IEEE TRANSACTIONS ON POWER ELECTRONICSno. 4 (2024): 3974-3978
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE Transactions on Power Electronicsno. 99 (2024): 1-5
2023 IEEE Energy Conversion Congress and Exposition (ECCE)pp.5934-5938, (2023)
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2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)pp.1-5, (2023)
IEEE Transactions on Power Electronicsno. 8 (2023): 9685-9694
IEEE Transactions on Electron Devicesno. 2 (2023): 633-639
2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)pp.1-4, (2023)
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APECpp.1622-1626, (2023)
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