Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Gong Yue Tang,Siow Pin Tan,Navas Khan,D. Pinjala,John H. Lau,Ai Bin Yu,Kripesh Vaidyanathan,Kok Chuan Toh

Components and Packaging Technologies, IEEE Transactions（2010）

引用 41|浏览5

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摘要

In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and fabricated, and the compact system is integrated. In line with the fluidic interconnect design and analysis, an experimental process for hydraulic characterization of the integrated cooling system is established. The pressure drops for different fluidic interconnects in this system are measured and compared with the analyzed results.

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关键词

fluidic interconnects,integrated circuit interconnections,hydraulic characterization,cooling,3d stacked tsv modules,three-dimensional integrated circuits,dissipation level,thermal management (packaging),sealing technique,integrated liquid cooling systems,modules,pressure drop,integrated circuit design,integrated circuit packaging,fluid interfaces,integrated cooling solution,seals (stoppers),thermal management,3-d tsv module,liquid cooling,silicon,microchannel,electronics packaging,heat sinks,thermal conductivity,heating,microelectronics

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