Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect

Electronic Components and Technology Conference（2015）

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摘要

We present the packaging of a large multi-chip energy-efficient WDM silicon photonic interconnect prototype enabled by hybrid integration, high-accuracy optical alignment and thermal-mechanical aware design and assembly.

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关键词

hybrid integration,packaging,energy-efficient WDM silicon photonic chip-to-chip interconnect,high-accuracy optical alignment,thermal-mechanical aware design,wavelength division multiplexing,Si

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