Design and fabrication of low-loss horizontal and vertical interconnect links using air-clad transmission lines and through silicon viasMarkrohit sharma[0]erdal uzunlar[0]vachan kumar[0]rajarshi saha[0]xinyi yeowrizwan bashirullah[0]azad naeemi[0]paul a kohl[0]2012.Cited by: 13|Bibtex|Views2|DOI:https://doi.org/10.1109/ECTC.2012.6249115Other Links: academic.microsoft.comKeywords: golddielectric lossesfabricationtransmission linesintegrated circuit designMore(2+)Code: Data: Full Text (Upload PDF)PPT (Upload PPT)SimilarReferenceCitedUpload PPTYour rating :0 TagsCommentsSubmit
