Wafer edge polishing process for defect reduction during immersion lithography

raymond maas
raymond maas
yufei chen
yufei chen
p p miller
p p miller
mani thothadri
mani thothadri
manjari dutta
manjari dutta
c lazik
c lazik
y uritsky
y uritsky

Proceedings of SPIE, 2008.

Cited by: 3|Views1

Abstract:

The objective of this study was to examine the defect reduction effect of the wafer edge polishing step on the immersion lithography process. The experimental wafers were processed through a typical front end of line device manufacturing process and half of the wafers were processed with the wafer edge polishing just prior to the immersio...More

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