Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and Opportunities

In this paper, 2.5-D integrated circuits (ICs) using bridge-chip technology are thermally evaluated to investigate thermal challenges and opportunities for such multi-die packages. To this end, the objectives of this paper are twofold. First, thermal benchmarking of a number of 2.5-D integration approaches is performed and compared to 3-D ICs for completeness. Thermal modeling shows that the evalu...