A Simulation Tool for Rapid Investigation of Trends in 3-DIC Performance and Power Consumption

William Wahby,Li Zheng,Yang Zhang,Muhannad S. Bakir

IEEE Transactions on Components, Packaging and Manufacturing Technology（2016）

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摘要

In order to compare the costs and the benefits of 2-D and 3-D integrated circuits (3-DICs) technologies, a compact simulation tool for 3-DIC system evaluation and design space exploration is presented. The simulator is implemented in the MATLAB, and is composed of several modules, including a compact 3-DIC wire-length distribution, a wire pitch and repeater insertion module, a 2-D and 3-DIC power ...

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关键词

Wires,Power demand,Wiring,System-on-chip,Solid modeling,Through-silicon vias,Integrated circuit modeling

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