Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

It is agreed that air-cooled heat sink (ACHS) would become incapable of 3-D integrated circuits (ICs). A switch from ACHS to a microfluidic heat sink (MFHS) is believed to be a promising solution. Tier-specific MFHS, where the flow rate of each tier can be controlled independently, has been further proposed in consideration of the power consumptions of pumps. However, these works are generally bas...