Hanju Oh

Binding

IEEE Transactions on Components, Packaging and Manufacturing Technology, pp.1-1, (2020)

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2019): 1244-1252

PloS one, no. 11 (2018)

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 11 (2018): 2039-2044

ACS applied materials & interfaces, no. 43 (2018): 37643-37650

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 7 (2017): 1003-1010

IEEE Transactions on Components, Packaging and Manufacturing Technology, no. 4 (2017): 502-510

topical meeting on silicon monolithic integrated circuits in rf systems, pp.1-3, (2017)

Heat Transfer Engineering, no. 11 (2016): 903-911

IEEE Transactions on Electron Devices, no. 3 (2016): 1176-1181

IEEE Transactions on Electron Devices, no. 6 (2016): 2503-2509

IEEE Transactions on Electron Devices, no. 6 (2016): 2510-2516

ieee workshop on signal and power integrity, pp.1-4, (2016)

electronic components and technology conference, pp.68-73, (2016)

IEEE Microwave and Wireless Components Letters, no. 3 (2016): 168-170

3DIC, (2015)

Microelectronic Engineering, no. C (2015): 30-35

Applied Physics Letters, (2014)