Compact EM Models for Multi-Segment Interconnect Wires

Long-Term Reliability of Nanometer VLSI Systems(2019)

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摘要
Many research attempts have been spent to derive exact and approximate mathematical models for the electromigration nucleation process for a single, straight-line structure investigated in reliability analysis. However, obtaining analytical solutions for electromigration-induced stress evolution in general interconnect structure is extremely difficult (if not impossible).
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