The unique properties of SiCN as bonding material for hybrid bonding

Serena Iacovo,Soon-Wook Kim,Fuya Nagano,Lan Peng,Fumihiro Inoue,Alain Phommahaxay,Eric Beyne

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2021）

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摘要

Direct Cu-SiCN hybrid bonding is successfully realized by using a thermal budget of 250 °C. The excellent results should be attributed to the tight control on the different processing steps but also to the properties of the SiCN dielectric used as bonding material.

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