Photonic Wire Bonding for Silicon Photonics III-V Laser Integration

Matthew Mitchell,Becky Lin,Iman Taghavi,Shangxuan Yu,Donald Witt,Kashif Awan, Steven Gou,Jeff Young,Lukas Chrostowski

2021 IEEE 17TH INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS (GFP 2021)（2021）

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摘要

Photonic wire bonding offers the opportunity to co-package lasers and silicon chips, solving a long-standing problem in integrated photonics, and enabling foundries to offer multi-project wafer runs featuring integrated lasers.

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关键词

Conferences,Lasers,Wires,Silicon photonics,Foundries,Bonding

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