Inline Tilt Measurements of Sintered Dies by Optical Line Scanning as Quality Assessment Tool for Smart Production

Tilt of semiconductor dies is a common issue during assembly in power electronics as, e.g. die bonding during silver sintering caused by inhomogeneous thicknesses of applied die-attach material, problems with a homogeneous force application, uneven substrates etc. This tilt usually leads to reliability problems later during testing or operation in the field. The reason behind this is a gradient in...