ESD process assessment of 2.5D and 3D bonding technologies

Marko Simicic, Frank Gijbels,Serena Iacovo,Shih-Hung Chen,Geert Van der Plas,Eric Beyne

2023 45TH ANNUAL EOS/ESD SYMPOSIUM, EOS/ESD（2023）

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摘要

Heterogeneous bonding technologies are an attractive way to assemble high performance computing systems today. However, ESD risks of 2.5D/3D bonding are not fully understood. To help ESD control engineers and tool manufacturers, this paper describes the 2.5D/3D bonding processes and gives practical insights into the relevant ESD process assessment steps.

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