Scaling of double-gated WS2 FETs to sub-5nm physical gate length fabricated in a 300mm FAB
2021 IEEE International Electron Devices Meeting (IEDM)(2021)
摘要
We present an analysis of gate length scaling of WS2 transistors fully fabricated in a 300mm pilot line. Despite low channel mobility,
$I_{\max}=100\mu \mathrm{A}/\mu \mathrm{m}$
is enabled by low side contact resistance
$R_{\mathrm{c}}=1.3\pm 1.0\mathrm{k}\Omega-\mu \mathrm{m}$
at
$n=3\times 10^{13}\text{cm}^{-2}$
. Hysteresis of 5m V/V at moderate electric fields is demonstrated. High single-device yield and low variability is achieved, and it is established that
$I_{\text{on}}$
correlates mainly with mobility and less with SS and
$V_{\mathrm{t}}$
. We demonstrate that switch-off can still be achieved with extremely scaled
$L_{\mathrm{g}}=2\text{nm}$
, but significant short-gate effects occur due to thick CET and unoptimized device configuration. We show better short-gate control with connected dual gate configuration. TCAD simulations identify the main performance bottlenecks and a path towards improved device performance over Silicon FETs.
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关键词
high single-device yield,short-gate effects,unoptimized device configuration,short-gate control,connected dual gate configuration,improved device performance,physical gate length,gate length scaling,low channel mobility,moderate electric fields,low side contact resistance,double-gated FETs,FAB,field effect transistors,TCAD simulations,silicon FETs,thick CET,size 300.0 mm,size 2.0 nm,WS2
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