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    大日本印刷

    大日本印刷

    Dai Nippon Printing
    企业
    762论文总数
    1万引用总数

    论文量&引用量时间轴

    机构学者

    排序
    Naoya Hayashi
    Naoya Hayashi
    Semicond Components Lab, Dai Nippon Printing Co Ltd
    论文:134引用:0H-index:0
    Hiroshi Mohri
    Hiroshi Mohri
    Aaron Diamond AIDS Research Center, The Rockefeller University
    论文:68引用:0H-index:0
    Yasutaka Morikawa
    Yasutaka Morikawa
    Semicond Components Lab, Dai Nippon Printing Co Ltd
    论文:42引用:0H-index:0
    Tsukasa Abe
    Tsukasa Abe
    Elect Components Lab, Dai Nippon Printing Co Ltd
    论文:26引用:0H-index:0
    Nobuhito Toyama
    Nobuhito Toyama
    Semicond Components Lab, Dai Nippon Printing Co Ltd
    论文:25引用:0H-index:0
    Masaaki Kurihara
    Masaaki Kurihara
    Faculty of Pharmaceutical Sciences, Shonan University of Medical Sciences
    论文:25引用:0H-index:0
    Morihisa Hoga
    Morihisa Hoga
    Research and Development Center, Dai Nippon Printing Co., Ltd
    论文:24引用:0H-index:0
    shiho sasaki
    shiho sasaki
    Semicond Components Lab, Dai Nippon Printing Co Ltd
    论文:21引用:0H-index:0
    Tadahiko Takikawa
    Tadahiko Takikawa
    Elect Device Lab, Dai Nippon Printing Co Ltd
    论文:17引用:0H-index:0

    论文(762)

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    1A Texture Rendering Method Through Control of the Reflection Properties on Resin Surfaces
    Naoki Kawai, Hirohisa Ota, Ryo Nakamoto, Yasunobu Idei
    2026International Conference on Computer Graphics and Interactive Techniques(2026)
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    247‐4: Optimization of Glass Core Substrate Design for Energy‐Efficient High‐Density AI Server Packages
    Satoru Kuramochi, Takahiro Tai, Koji Fujimoto,Masaya Tanaka,Takamasa Takano

    A heterogeneous AI server package integrating XPU–HBM chiplets and co‐packaged optics (CPO) on a glass core substrate is presented. This work addresses system‐level mechanical, electrical, and power co‐optimization for multi‐module integration on glass, rather than substrate process comparison, by evaluating CTE‐induced warpage, TGV‐based power delivery, electromigration robustness of inorganic‐coated RDL layers, and high‐speed signal transmission between XPU and CPO modules. The results demonstrate improved signal integrity, power efficiency, and reliability for large‐scale, energy‐efficient AI server packages.

    2026SID Symposium Digest of Technical Papers(2026)
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    3Aluminum and Plastic Recovery from Aluminum Laminates Using Electrical Pulsed Discharge.
    Takuji Kirihara, Asako Narita, Sayako Kanazawa, Satoshi Mitsuzuka, Miho Sasaki,Chiharu Tokoro

    Aluminum laminates, widely used in food packaging, are difficult to recycle because of their complex multilayer structures, leading to disposal primarily through landfilling or incineration. In this study, we propose a method for separating aluminum foil and plastic layers from aluminum laminates using electrical pulsed discharge (EPD). Since EPD can selectively heat the aluminum foil, its energy consumption is expected to be lower than that of conventional thermal processes. However, the applicability of EPD to various aluminum laminates and its separation mechanism have not yet been fully elucidated; thus, this study aimed to investigate these aspects. EPD was applied to four aluminum laminates with varying layer thicknesses to investigate their separation behaviors. Successful separation was achieved for all samples except the thinnest one, with high aluminum recovery rates (93.6-98.7 wt%) and purity (96.6-99.7 wt%). Also, the chemical analysis of the recovered resins showed almost no change before and after the pulsed discharge. To elucidate the separation mechanism, high-speed camera imaging, heat transfer and thermal stress simulations were conducted. The results revealed that successful delamination requires both sufficient energy to decompose the interfacial resin and adequate thermal stress to propagate the delamination. To evaluate the environmental impact of the EPD method, its energy consumption and greenhouse gas (GHG) emission were compared with those of other separation methods. EPD-based recycling process demonstrated superior energy efficiency and GHG emission reduction compared to conventional processes.

    2026Waste management (New York, NY)(2026)
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    4High-Density Polymer Waveguide Integration on Glass Substrate for CPO
    Takuya Kitainui, Yujiro Saito, Naoki Fukuda, Kenichi Ogawa

    The demand for high-speed signal transmission technologies is increasing, and co-packaged optics, which significantly reduces electrical transmission distances, is attracting growing attention. This report presents the performance evaluation results of a glass substrate with integrated polymer optical waveguides that we have been developing. The optical waveguides were successfully fabricated with a minimum pitch of 10 micrometers using imprint lithography. For the 10-micrometer-pitch optical interconnects, it was confirmed that crosstalk can be effectively suppressed by increasing the relative refractive index difference. In addition, the reliability of the optical waveguide material was also evaluated. Within the evaluated period, the waveguides were confirmed to exhibit sufficient reliability in terms of single-mode propagation and bending loss.

    20262026 IEEE 76th Electronic Components and Technology Conference (ECTC)(2026)
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    5Practical Evaluation Method for Reflected Power of Electrically Large IRS in the Near-Field Region: Synthesis of Reflected E-Field of Sub-IRS
    Hiromi Matsuno, Takuya Ohto,Takahiro Hayashi,Mitsutaka Okita, Shinichiro Oka, Naonobu Yoshii, Masakazu Nakatani,Hideo Fujikake,Hiroyasu Sato,Keisuke Konno,Qiang Chen

    The use of intelligent reflecting surfaces (IRSs) to enhance coverage in millimeter-wave bands has been gathering attention. To utilize IRS in mobile networks, it is necessary to determine the reflected power of the IRS. As the electrical size of the IRS must be large to enhance the reflected power, its application in the near-field region (Fresnel region) should increase. In addition, an actual IRS is affected by unaccounted errors such as reflection phase errors, reflection amplitude errors, and mutual coupling. A practical evaluation method for electrically large IRS is required for highly accurate reflected power estimation. To address these problems, we propose dividing electrically large IRS into sub-IRSs to synthesize the reflected E-field from each sub-IRS. The reflected E-field was estimated using the measured radar cross-section (RCS) of the sub-IRSs. To compensate for the differences in the incident and reflection angles of each sub-IRS, we proposed estimating the difference using a geometrical approach. The power reflected from each sub-IRS is estimated by shifting the reflection angle in the RCS pattern. The numerical results verified that the reflection power of the electrically large IRS was estimated with high accuracy while the location of each transmitting point and observation point met the far-field condition of the sub-IRS. The measurement results in an anechoic chamber also verified that the proposed method could estimate the reflected power with high accuracy compared with the conventional physical optics (PO)-based approach. The median power difference of the proposed method and measured results was approximately 3 to 4 dB, and the correlation between them exceeded 0.77, which are superior to those of the conventional PO-based approach.

    2026
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    合作机构(100)

    东京大学合作论文 49
    大阪大学合作论文 16
    东京工业大学合作论文 12
    索菲亚大学合作论文 11
    京都大学合作论文 10
    东北大学(日本)合作论文 9
    筑波大学合作论文 9
    北海道大学合作论文 8
    National Livestock Breeding Center合作论文 8
    东京医科歯科大学合作论文 8

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