简要介绍了纳米压印技术的原理及应用,阐述了热纳米压印、紫外纳米压印、微接触压印等纳米压印工艺,分析了每种工艺的特点及优势;同时总结了纳米压印设备的3个关键技术,重点分析了精密对准调平技术、压力控制技术和模板分离技术.
The main problem faced by the application of multiprocessor system in embedded application is the communication between multiprocessor cores. This paper studies the inter-core synchronization and multi-core communication mechanism of TI-C6678 processor. It mainly introduces several common methods of inter-core communication: shared memory communication,inter-core interrupt communication,IPC Notify communication and Message communication. It designs and implements the multi-core communication. From the perspective of the system,it designs and simulates the implementation of multi-core communication,and analyzes and compares the performance. It has certain guiding value for the design of inter-core communication of multi-core DSP processors.
Based on the probe device,the logging function is described emphatically. Set the log information storage content according to the technical requirements of the device and customer requirements,and establish a unified channel of log information storage for each module of the device. Using VS2019+QT development platform for functional development. To realize real-time display of operation status and process parameter data on the device running program interface,record user’s operation information,provide efficient tracing channels for finding operation problems,cooperate with other module developers to achieve error information classification and display of log information after error,and realize customers’ demand for quick error search.
As semiconductor industry standard,SEMI standard is international standard. To discuss the application of SEMI standard in semiconductor manufacturing equipment,SEMI S2 semiconductor equipment safety guideline and SEMI F47 voltage sag immunity standard including its practical application are introduced. SEMI S23 energy efficiency standard and SECS/GEM communication standard along with its status of research are analyzed. It is proposed that developing Chinese Semiconductor Industry rapidly requires to enhance the application and popularization of SEMI standard.
Taking wire bonder as an object,the influences of equipment mechanism,process flow and parameters on integrity of bonding point during wire bonding process is studied. The experimental results show that the integrity of bonding points can be ensured by reducing the pressure of the splitter on bonding points and using small ultrasonic assisted breaking before breaking the wire.
Based on the theory of Finite Element Analysis（FEA）,ANSYS software is used for meshing and attribute definition,and modal analysis is carried out for the support frame of the exchange robot. LMS Testlab equipment is used to carry out the modal test of the support frame,and the results show that the error between the modal simulation results and the test results is within the permissible range. The accuracy and reliability of simulation and test results are verified. It provides a theoretical basis for the optimal design of the support frame and is used to guide the actual production design.
The mechanism of plasma production and the principle of plasma cleaning technology are introduced. A kind of chamber of plasma cleaning machine is presented,which is characterized by the horizontal flow of process gas from left to right. Each chamber plate with small holes can be flexibly configured as suspension electrode, anode and cathode. After selecting the appropriate process conditions,good cleaning effects could be obtained.
A new graphite boat plasma cleaning equipment can effectively reduce the cleaning time,reduce the usage amount of phosphoane in amorphous silicon deposition process,and improve Tunnel Oxide Passivated Contact（TOPCon） solar cell conversion efficiency. It has great competitive advantage over wet cleaning. The effect of plasma cleaning parameters on the conversion efficiency of solar cells is studied,the best process parameters are obtained,e.g.,the temperature of the graphite boat is 300 ℃,the cleaning time is 150 min,and the flow rate of phosphoane in the amorphous silicon deposition process is halved. The conversion efficiency of TOPCon solar cell reached 24.154%,which is 0.033% higher than wet process equipment.
The functions application and development of Agilent network analyzer are introduced in this paper. The Agilent E5071C is connected with the PC terminal,GPIB communication and corresponding SCPI control instructions are adopted,and the application and development of bandwidth test and limit test functions are completed with C++.
Combining with the production process of automatic graphite sheet attachment machine,the composition of visual measurement and the design process of the measurement system are introduced in this paper, the calibration and image processing methods of the visual measurement system. And according to the actual measurement data,the data results of GR＆R（Repeatability and Reproducibility of Measurement） are achieved,which can provide guidance on how to reduce measurement errors.
A kind of high precision hardware circuit of multichannel temperature acquiring system is introduced,in the system,the single chip microcomputer MCU is used as core. The system can automatically process 8 channels of high precision temperature sensors signal. It can automatically celebrate,output invariable current supply, automatic range switching. It is suited to precision measurement for adopt NTC（Negative Temperature Coefficient） sensor,also be used for PT100,PT1000,PTC measure,and so on. The system with RS485 asynchronous communication interface,implement the communication with the upper computer. The method of look-up table procedures and the algorithm of piecewise linear interpolation are adopted in nonlinearity correction of sensor,it can assure high detection precision.
The reasons that affecting hole metallization quality are obtained by combination of hole metallization process experiment and its principle in this paper. It is pointed out that artificial positioning process is the main reason to determinate hole metallization quality. By changing positioning method could assure hole metallization quality well. The new structure of hole metallization is introduced,the structural composition and principle of new structure are analyzed. Furthermore,by process experiment,it is concluded that new structure of the hole metallization could solve the problem of hole metallization quality well.
中国电子科技集团公司第四十五研究所坚决贯彻落实党的二十大精神,通过学报告悟精神,抓落实强责任,见行动勇担当等工作,增强了自主攻关、创新克难的信心和勇气,实现了综合实力的整体提升,开启了高质量发展新征程.为实现电子制造装备产业整体实力提升提供了理论指导,为做精做强产业基础、突破技术难关瓶颈提供了创新方法,为填补国内技术空白、支撑可持续高质量发展提供了良好借鉴作用.
Through flow decomposition of Wet Etching Unloader,a calculation method of productivity is summed up,which can be used to analyze the bottleneck problem restricting equipment productivity.This method helps us proficiently match relevant components,optimize design scheme,increase equipment productivity,and improve stability and reliability of the equipment.
Low-pressure chemical vapor deposition is used to grow low-stress Si 3 N 4 film on a silicon substrate by changing the process gas ratio. The stress,growth rate,uniformity,refractive index,and corrosion rate of the generated silicon nitride thin film are characterized by a stress meter and an ellipsometer. The experimental results show that the key to preparing low-stress silicon nitride films is to increase the ratio of DCS to ammonia. The larger the ratio,the smaller the film stress of silicon nitride generated by LPCVD, the larger the refractive index, the stronger the acid corrosion resistance,and the better the compactness. However,as the proportion increases,the uniformity of the resulting silicon nitride film becomes worse. Selecting the appropriate process ratio can produce high-quality low-stress silicon nitride film on silicon substrates.
In order to avoid punching quality issues caused by needle wear and reduce the cost increase of change punching needles,the article combined with the green porcelain manufacturer,the thickness of the green porcelain,with or without film,and the diameter of the punching needle,the number of times the punching needle are used to predict and analyze the lifetime of the punching needle,in-depth research has been carried out on the prediction technology of the punching needles life of punching machines. According to the analysis results,a decision is made on whether the punching needle can continue to punch. The proposal of this technology provides a suitable time for the replacement of punching needles of the punching machine,reduces the scrap of products and saves the cost.
The basic working principle and components of the vector network analyzer are introduced briefly in this paper for semiconductor test system. Five common faults phenomena are vividly introduced through the combination of pictures a characters description,which is convenient for maintenance personnel to understand,and provides these faults maintenance methods to improve the maintenance experience of maintenance personnel.
According to the working process of automatic flannel-making and feeding machine,the steps and actions to limit the capacity increase are analyzed,and reasonable improvement methods are proposed. By improving the equipment structure and optimize procedures, the visual module,traceability function,and AGV system are optimized,and the equipment capacity and stability of equipment operation are improved,and the equipment quality and competitiveness are improved.
The particle count of CMP post clean is a key point in CMP process. in this process,the cleaning effect after CMP is tested and analyzed. The effects of hydrophilicity and hydrophobicity of wafer surface and concentration of cleaning liquid on cleaning effect are analyzed. The results show that after cleaning and polishing with a certain concentration of cleaning liquid,the wafer can obtain a better surface particle condition and meet the process requirements.
In order to meet the performance requirements of the multi-DOF precision motion console,the communication between the motion console control software and the control board are studied in this paper,and based on model development,an embedded communication strategy is proposed. The experiment results show that the strategy can transmit data accurately and steadily,and with two advantages in code development efficiency and transmission data standardization. At present,the strategy is applied to a certain type of integrated circuit manufacturing equipment,which improves the debugging efficiency of the equipment and providing high engineering value.
