简要介绍了纳米压印技术的原理及应用,阐述了热纳米压印、紫外纳米压印、微接触压印等纳米压印工艺,分析了每种工艺的特点及优势;同时总结了纳米压印设备的3个关键技术,重点分析了精密对准调平技术、压力控制技术和模板分离技术.
The main problem faced by the application of multiprocessor system in embedded application is the communication between multiprocessor cores. This paper studies the inter-core synchronization and multi-core communication mechanism of TI-C6678 processor. It mainly introduces several common methods of inter-core communication: shared memory communication,inter-core interrupt communication,IPC Notify communication and Message communication. It designs and implements the multi-core communication. From the perspective of the system,it designs and simulates the implementation of multi-core communication,and analyzes and compares the performance. It has certain guiding value for the design of inter-core communication of multi-core DSP processors.
Based on the probe device,the logging function is described emphatically. Set the log information storage content according to the technical requirements of the device and customer requirements,and establish a unified channel of log information storage for each module of the device. Using VS2019+QT development platform for functional development. To realize real-time display of operation status and process parameter data on the device running program interface,record user’s operation information,provide efficient tracing channels for finding operation problems,cooperate with other module developers to achieve error information classification and display of log information after error,and realize customers’ demand for quick error search.
As semiconductor industry standard,SEMI standard is international standard. To discuss the application of SEMI standard in semiconductor manufacturing equipment,SEMI S2 semiconductor equipment safety guideline and SEMI F47 voltage sag immunity standard including its practical application are introduced. SEMI S23 energy efficiency standard and SECS/GEM communication standard along with its status of research are analyzed. It is proposed that developing Chinese Semiconductor Industry rapidly requires to enhance the application and popularization of SEMI standard.
Taking wire bonder as an object,the influences of equipment mechanism,process flow and parameters on integrity of bonding point during wire bonding process is studied. The experimental results show that the integrity of bonding points can be ensured by reducing the pressure of the splitter on bonding points and using small ultrasonic assisted breaking before breaking the wire.
