The paper describes that the advantage and significance of ultra-thin embedded capacitor.In the embedded capacitor of PCB,except for the material handling of ultra-thin material,other processing are compatible with standard PCB.

The paper describes that achieves through hole filling by accelerator-free formulas in DC plating.A possible electrochemical mechanism for through hole filling is proposed in the paper.

The paper describes that the developments of 30 years of rigid-flex PCB production.Today,all develop-ments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.

文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展.

As the electronics industry to lead-free soldering,hot air leveling should continue to be preferredmethod of preserving solderability.

This paper describes the use of electrically mediated microetching on the test samples with a variety ofcopper line widths and spacing has proven effective.The undercut,etch factor and tanθ values were better thanstandard spray etching process.

This paper describes the new HT-OSP (high temperature –organic solderability preservative) are among the leading surface finish options in lead-free soldering. Because of their excellent solderability, ease of processing,and low cost.

This article describes the different types of applications,bonding films,equipment needs,and bonding methods used to produce low-count and high-count PTFE multiplayer boards.

概述了挠性和刚-挠性板的前处理工艺.等离子态去钻污费时和成本高,采用改进的前处理的化学镀铜可以满足挠性印制电路(FPC)大生产的要求.

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost.

综述了环氧树脂基的PCB与无铅化组装的兼容性问题.经过大量试验表明,常规的FR-4基材和双氰胺固化的高Tg基材是不能满足无铅化组装要求的,而采用酚醛固化的中等-Tg的环氧树脂基材是可能成为无铅化组装用基材的.同时,PCB制造过程也起着重要的作用.PCB设计和再(回)流焊的加热梯度也影响着无铅化的性能.

A discussion of rigid-flex circuit board material for applications in automotive electronicsystems,including the flexible multiflex(PI) circuit material,the flexible semiflex(thin FR-4) circuit material,and the flexible yellow-flex circuit material.

This paper summarizes the technology drivers that impact packaging and PCB structures.IC progress and electronic product propertys is key point.

PurposeThis paper aims to explain how the goals have been met to manufacture rigid‐flex printed circuit boards (PCBs) in equipment used for rigid PCBs by utilizing new materials and process combinations.Design/methodology/approachA discussion of the technology and applications.FindingsThe main drivers for PCB technology have been size reduction, increased resolution, improved high frequency performance together with increased reliability and cost savings. To reach higher packaging density at the PCB level, Aspocomp has developed the technology with embedded active and passive components. However, in higher packaging density applications, the PCB‐technology has to offer more flexibility to PCB‐designers in order to effectively utilize space inside the electronic devices. Different flexible PCB solutions are needed to achieve this goal.Practical implicationsFor fabricators of rigid PCBs there are challenges in production to adopt the new industry requirements.Originality/valueThis paper is of value to those involved with or interested in PCB technology.

This paper summarizes the type,application advantage and tendency of direct writing technique in electronic industry.

The paper research that effect of PTFE is used Na etch and plasma process on the metallization and plating.

This paper introduces the technology of the integrated optical data bus with EOI waveguide in PCB.

The paper summarizes that the advantage and applicable field of immersion silver.

This article summarizes the benefits and application effect of latest generation OSP.

当设计具有埋入无源元件的PCB时,必须仔细考虑影响修整生产率和准确性的因素,而采用激光修整是最佳的.