Nanocomposite films of zirconium nitride/silver were deposited by unbalanced magnetron sputtering on stainless steel SS316 substrates. The structure of the films was characterized by means of X-ray diffraction (XRD) and transmission electron microscopy (TEM). The films were found to form a dense and homogeneous microstructure whereby nanocrystals of Me are distributed evenly throughout the ZrN matrix. The elemental composition was determined by X-ray photoelectron spectroscopy (XPS). The mechanical properties of these films were analyzed using an atomic force microscope (AFM) in conjunction with Hysitron Triboscope. The hardness and elastic modulus were found to depend on elemental composition and deposition parameters. Microwear measurements were carried out using positive constant normal loads and the wear tracks were imaged and processed using the ProScan Image Processing software. Reported are values for the friction coefficients, residual depth of indentations, wear volumes, and surface roughness. Finally, the coatings were worn against ball-bearing steel using a ball-on-disk tribotester. A low wear coefficient of 2.1×10−7 mm3/s was obtained for a load of 5 N.

This paper reports on a systematic investigation of the optical properties of Ta(1-x)Zr(x)N single-phase and ZrN-Ag multi-phase films fabricated by unbalanced magnetron sputtering using vacuum ultraviolet spectroscopic ellipsometry (VUV-SE). VUV-SE is a newly developed technique that was used to evaluate the strength and energy of the interband electronic excitations/transitions in these films. The energy of the interband transition was found to be altered by any changes in the elemental composition for single-phase materials. For example, it was found to increase with the increase in the covalent character of the bond as more Zr atoms are substituted for by Ta atoms in the ZrN rock-salt structure. In contrast, the peak positions did not vary in the multi-phase structures because the constituent phases were immiscible and retained their electronic structure. However, the strength and width of the interband transition were found to change to reflect changes in phase composition and microstructure. The optical and electronic properties of these materials were simulated using density functional theory (DFT) within the generalized gradient approximation. The calculated refractive indices and density of states were in good agreement with the VUV-SE data.

This article reports on a systematic investigation of the electronic and optical properties of Ta1−xZrxN films fabricated using unbalanced magnetron sputtering. X-ray diffraction confirmed that the films formed a solid solution that corresponded to a rocksalt structure. Rutherford backscattering revealed the elemental composition of the films. Ultraviolet photoelectron spectroscopy was used to investigate the valence band electronic structure while vacuum ultraviolet spectroscopic ellipsometry (VUV–SE) was used to evaluate the strength and energy of their interband electronic excitations/transitions. The optical and electronic properties of these materials were simulated using density functional theory within the generalized gradient approximation. The calculated refractive indices and density of states were in good agreement with the VUV–SE data and the valence band photoelectron spectra. In addition, the computational results were instrumental in indicating the correlation between the measured optical and electronic properties to their bond strength and elemental composition.

This article reports on the use of real-time spectroscopic ellipsometry (RTSE) to (1) understand the growth process of ultrathin (10 nm thick) Ta–Si–N diffusion barriers and to (2) monitor their thermal stability up to a temperature of 800 °C. Thin films of Ta–Si–N diffusion barriers and Cu overlayers were deposited on Si(111) substrates using reactive unbalanced magnetron sputtering. In order to reduce roughness and interdiffusion between consecutive surfaces, a modulated low energy and high flux ion assistance was utilized. The initial part of the films (2 nm) of each layer was deposited with a high flux of low energy ions (<10eV) to reduce intermixing, while higher energies (between 40 and 130 eV) were utilized for the remainder of the layer to decrease the percolation thickness. RTSE data were simulated using the Drude-Lorentz model to obtain information about the growth mechanism and the conduction electron transport properties for these structures. The films were annealed at 800 °C and the diffusion of copper into silicon was evaluated by monitoring changes in the optical properties of the bilayers. The pseudodielectric function of the films was found to be altered whenever diffusion proceeded. Thermal stability at 800 °C was achieved for samples produced using the ion-assistance technique. The results deduced from RTSE were verified by characterizing the elemental composition of the as-deposited and heat-treated films using Rutherford backscattering and time-of-flight secondary ion mass spectrometry.

This paper describes key technology implementation details and performance characteristics of a printer and typewriter using the resistive ribbon technology. The work describes the first commercial application of this print and correction technology. Key parameters necessary for proper system function such as current, various forces, velocities, and component integration are discussed. The rationales behind various compromises and problem solutions are given. A discussion of the characteristics of the print produced, along with application strengths and weaknesses, completes the paper.

The system controls for a printer using the resistive ribbon print technology involve conventional requirements, such as moving the print mechanism relative to the paper, with a new requirement, controlling the electrical energy to the ribbon, an electrothermal component. Other special requirements are dictated by using the same ribbon for hard copy print/erase while ensuring that the print and erase operations are acceptable to the user. This paper discusses the design and performance of the system controls for a resistive ribbon printer that was developed for use in an interactive typewriter application and as an output printer for a personal computer.