A high-indium-content InGaN quantum-well structure was grown on a strain-relaxed InGaN template to reduce structural strain induced by lattice mismatch. The results show that the InGaN template, following a nanosculpting process, can maintain the good crystal quality of the underlying GaN layer and provide a new lattice parameter for pseudomorphically growing a high-indium-content quantum-well structure, and the fourth-order satellite peak of the multi-quantum-well structure is clearly distinguishable. Atom misalignment, a strain gradient, and a composition undulation along the growth direction in the quantum-well structure were not observed by high-resolution transmission electron microscopy and selected area diffraction.

Indium-rich InGaN epitaxial layers with a p-i-n structure were grown pseudomorphically on a strain-relaxed InGaN template to reduce structural strain induced by lattice mismatch. We applied a nano-sculpting process to improve the crystal quality of the strain-relaxed InGaN template. The results show that the nano-sculpting process can suppress effectively the threading dislocation generation and improves significantly the I-V characteristic of the InGaN p-i-n structure. This InGaN template technique with nano-sculpting process shows great potential for future applications in indium-rich InGaN optic-electron devices.

The effects of H-plasma treatment on the electroluminescence (EL) of ZnO-based light-emitting diodes have been investigated systematically. After H-plasma treatment, the EL intensity of the n-ZnO/AlN/p-GaN device is observed to be three times stronger than its as-grown counterpart under the same injection current, and the threshold voltage of the device is significantly reduced simultaneously. The increases in electron concentration and mobility of the ZnO layer resulting from the incorporation of hydrogen atoms into ZnO are considered to be responsible for the improved performance of the ZnO-based light-emitting diodes. (C) 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

Real time detection of vitellogenin in largemouth bass serum was demonstrated using AlGaN/GaN HEMTs. Antivitellogenin antibodies were chemically anchored to the gold-coated gate area of the HEMT by thioglycolic acid. The potential difference that occurred from the vitellogenin antigen/antibody interaction induced a drain current change. The sensor was able to detect as low as 4 mu g/mL Vtg. Successful detection in serum samples shows that HEMTs have the potential to be used as biological sensors in real-world applications. (C) 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

The effects of the growth temperature and thickness of AlN layer on the electroluminescence (EL) performance of n-ZnO/AlN/p-GaN devices have been systematically investigated. It is found that the higher growth temperature of AlN layer (TAlN) may facilitate the improvement of EL performance of the device, which is attributed to that the crystalline quality of AlN layer improves with increasing growth temperatures TAlN. Besides the crystallinity of AlN layer, the thickness of AlN barrier layer plays an important role on the performance of the device. The thinner AlN layer is not enough to cover the whole surface of GaN, while the thicker AlN layer is unfavorable to the tunneling of carriers and many of electrons will be captured and recombined nonradiatively via the deep donors within the thick AlN layer. We have demonstrated that the AlN layer at the growth temperature of 700 °C with an optimized thickness of around 10 nm could effectively confine the injected carriers and suppress the formation of interfacial layer, thus, the EL performance of n-ZnO/AlN/p-GaN device could be significantly improved.

We report on the novel normally-on/off AlN/GaN high electron mobility transistors (HEMTs) grown by plasma-assisted molecular beam epitaxy. With simple oxygen exposure, the threshold voltage can be tuned from -2.76 V to +1.13 V depending on the treatment time. The gate current was reduced and current-voltage curves show metal-oxide semiconductor diode-like characteristics after oxygen plasma exposure. The extrinsic transconductance of HEMTs decrease with increasing oxygen plasma exposure time due to the thicker Al oxide formed on the gate area. The unity current gain cut-off frequency, fT, and maximum frequency of oscillation, fmax, were 20.4 GHz and 36.5 GHz, respectively for an enhancement-mode HEMT with the gate dimension of 0.4 × 100 μm2. (© 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

Ozone treatment of AlN on AlN∕GaN heterostructures produces effective surface passivation and chemical resistance to the AZ positive photoresist developer used for subsequent device fabrication. The ozone-passivated AlN∕GaN high electron mobility transistors (HEMTs) exhibited low gate leakage currents, high gate modulation voltage, and minimal drain current degradation during gate pulse measurements. With an additional oxygen plasma treatment on the gate area prior to the gate metal deposition, enhancement-mode AlN∕GaN high electron mobility transistors were realized. The gate characteristics of the HEMTs treated with the ozone and oxygen plasma behaved in a manner similar to a metal oxide semiconductor diodelike gate current-voltage characteristic instead of a Schottky diode. Drain breakdown voltages of 23 and 43V for d- and e-mode HEMTs were obtained, respectively. For d-mode HEMTs, there was no reduction in the drain current during the gate pulse measurements at frequencies of 1, 10, and 100kHz. For the e-mode HEMT, the drain current was reduced 5% at 100kHz.

Endocrine disrupters are known to have negative effects on the environment and human health. Real time detection of vitellogenin, an endocrine disrupter biomarker, was demonstrated using AlGaN/GaN high electron mobility transistors (HEMTs). Anti-vitellogenin antibodies were chemically anchored to the gold-coated gate area of the HEMT and immobilized with thioglycolic acid. The potential difference that occurs from the vitellogenin antigen-antibody interaction-induced caused a drain current change in the HEMT. The HEMT sensor was tested for vitellogenin detection both in phosphate buffer saline and largemouth bass serum.

n-ZnO/p-GaN heterojunction light-emitting diodes with and without a sandwiched AlN layer were fabricated. The electroluminescence (EL) spectrum acquired from the n-ZnO/p-GaN displays broad emission at 650 nm originating from ZnO and weak emission at 440 nm from GaN, whereas the n-ZnO/AlN/p-GaN exhibits strong violet emission at 405 nm from ZnO without GaN emission. The EL intensity is greatly enhanced by inserting a thin AlN intermediate layer and it can be attributed to the suppressed formation of the GaOx interfacial layer and confinement effect rendered by the AlN potential barrier layer.

In this work, we demonstrate various ohmic contact forma- tion processes using an AlN/GaN (MOS)HEMT structure with an aluminum oxide gate dielectric formed by ALD. The MO- SHEMT structure is advantageous because the thin oxide layer protects the ultra-thin (~3 nm) AlN barrier against exposure to the processing chemicals. Contact resistance values as low as 0.457 Ω·mm are reported on TLM structures. The correspond- ing devices exhibited excellent electronic transport properties with room temperature mobility µ > 1000 cm2/V·s and sheet carrier concentration nS > 3.25 x 10 13 cm-2. These are the low- est contact resistance values obtained for AlN/GaN HEMTs in the high mobility range (> 1000 cm2/V·s).

Enhancement mode AlN/GaN high electron mobility transistors (HEMTs) were fabricated from originally depletion-mode structures using oxygen plasma treatment on the gate area prior to the gate metallization. Starting with a depletion mode AlN/GaN HEMT, the threshold voltage of the HEMT could be shifted from −3.2 to 1 V depending on the oxygen plasma treatment time to partially convert the AlN barrier layer into Al oxide. The gate current was reduced and the current-voltage curves show metal-oxide semiconductor diodelike characteristics after oxygen plasma treatment.

The electrical and structural properties of AlN/GaN heterostructures grown by molecular beam epitaxy on sapphire are compared with those of AlGaN/GaN heterostructures. The structural characteristics as assessed by x-ray diffraction show little difference but the electron density in the two-dimensional electron gas is about twice higher for AlN/GaN structures with only slightly lower mobility than in AlGaN/GaN. By proper choice of the Fe doping in GaN(Fe) and the thickness of unintentionally doped GaN layers, the composite buffer of the structure can be made semi-insulating. The current through the AlN/GaN structures is determined by tunneling through the AlN barrier and is much higher than that for AlGaN/GaN films due to the lower thickness of AlN compared to AlGaN. Increasing the thickness of AlN from 3 to 4 nm decreases the leakage current by about an order of magnitude.

Low defect AlN/GaN high electron mobility transistor (HEMT) structures, with very high values of electron mobility (>1800 cm2/V s) and sheet charge density (>3×1013 cm−2), were grown by rf plasma-assisted molecular beam epitaxy (MBE) on sapphire and SiC, resulting in sheet resistivity values down to ∼100 Ω/◻ at room temperature. Fabricated 1.2 μm gate devices showed excellent current-voltage characteristics, including a zero gate saturation current density of ∼1.3 A/mm and a peak transconductance of ∼260 mS/mm. Here, an all MBE growth of optimized AlN/GaN HEMT structures plus the results of thin-film characterizations and device measurements are presented.

The effects of 10MeV electron irradiation on AlGaN∕GaN and AlN∕GaN heterojunctions grown by molecular beam epitaxy are reported. The irradiation increases the resistivity of the GaN buffer due to compensation by radiation defects with levels near Ec−1eV and decreases the mobility of the two-dimensional electron gas (2DEG) near the AlGaN∕GaN (or AlN∕GaN) interface. The bulk carrier removal rate in the GaN buffer is the same for both types of structures and similar to carrier removal rates for undoped n-GaN films. In structures with a density of residual donors of ∼1015cm−3, irradiation with electron doses of ∼5×1015cm−2 renders the buffer semi-insulating. The 50% degradation of the 2DEG conductivity happens at several times higher doses (close to 3×1016cm−2 versus 6.5×1015cm−2) for AlN∕GaN than for AlGaN∕GaN structures, most likely because of the lower thickness of the AlN barrier.

The electrical properties of AlGaN∕GaN high electron mobility transistor structures grown on composite GaN(Fe)∕GaN buffers by molecular beam epitaxy were reported. The concentration of Fe in the GaN(Fe) layer ranged from 8×1016to3×1017cm−3 as established by secondary ion mass spectrometry. The thickness of the undoped GaN layer of the buffer was varied from 2.2to4.1μm. For thinner buffers and higher Fe concentration, the buffer was semi-insulating, with the Fermi level pinned near Ec-0.57eV. For thicker buffers and lower Fe concentration, the top part of the buffer was conducting. Admittance spectra measured in conducting buffers also showed a prominent contribution from Ec-(055–0.6)eV electron traps. Despite the universal prominence of these traps in all our films, the behavior of their concentration with Fe doping and with increased distance from the GaN (Fe)∕GaN boundary is not compatible with the assumption that they are due to substitutional Fe acceptors. Possible compensation mechanisms in the studied structures were discussed.

The origin of hysteresis in capacitance-voltage (C-V) characteristics was studied for Schottky diodes prepared on AlGaN∕GaN transistor structures with GaN (Fe) buffers. The application of reverse bias leads to a shift of C-V curves toward higher positive voltages. The magnitude of the effect is shown to increase for lower temperatures. The phenomenon is attributed to tunneling of electrons from the Schottky gate to localized states in the structure. A technique labeled “reverse” deep level transient spectroscopy was used to show that the deep traps responsible for the hysteresis have activation energies of 0.25, 0.6, and 0.9eV. Comparison with deep trap spectra of GaN buffers and Si doped n-GaN films prepared on GaN buffers suggests that the traps in question are located in the buffer layer.