The importance of flip chip technology is beginning to grow as the use of such technology is seen to be more and more advantageous. The search for alternatives to lead-based solder has also led to the study of conductive adhesives as a possible replacement for solder interconnect technology. Under a grant from DARPA, the IBM and Universal Instruments Corporations have sought to create a flip chip package using conductive adhesive interconnects. This paper presents the preliminary results of mechanical testing designed to determine the static failure envelope of the adhesive. A difference in fracture mode was observed between the tensile and compressive samples indicating that a change in failure mechanism occurred. Further work is being conducted in order to isolate the specific failure mechanisms involved.