The crystalline structure and impurity profiles of HgCdTe/CdTe/alternate substrate (AS; Si and GaAs are possibilities) and CdTe/AS were analyzed by secondary-ion mass spectrometry, atomic force microscopy, etch pit density analysis, and scanning transmission electron microscopy. Impurities (Li, Na, and K) were shown to getter in as-grown CdTe/Si epilayers at in situ Te-stabilized thermal anneal (~500°C) interfaces. In HgCdTe/CdTe/Si epilayers, indium accumulation was observed at Te-stabilized thermal anneal interfaces. Impurity accumulation was measured at HgCdTe/CdTe and CdTe/ZnTe interfaces. Processing anneals were found to nearly eliminate the gettering effect at the in situ Te-stabilized thermal anneal interfaces. Impurities were found to redistribute to the front HgCdTe/CdTe/Si surface and p–n junction interfaces during annealing steps. We also investigated altering the in situ Te-stabilized thermal anneal process to enhance the gettering effect.

This paper presents the status of HgCdTe growth on large-area Si and CdZnTe substrates at Raytheon Vision Systems (RVS). The different technological tools that were used to scale up the growth from 4 inch to 6 inch diameter on Si and from 4 cm × 4 cm to 8 cm × 8 cm on CdZnTe without sacrificing the quality of the layers are described. Extremely high compositional uniformity and low macrodefect density were achieved for single- and two-color HgCdTe layers on both Si and CdZnTe substrates. Finally, a few examples of detector and focal-plane array results are included to highlight the importance of high compositional uniformity and uniformly low macrodefect density of the epitaxial layers in obtaining high operability and low cluster outages in single- and two-color focal-plane arrays (FPAs).

HgCdTe grown on large-area Si substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive CdZnTe substrates. The goal of this work is to evaluate the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (MWIR/LWIR) dual-band FPAs. A series of MWIR/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction (TLHJ) device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. The wafers showed low macrodefect density (<300 cm−2) and was processed into 20-μm-unit-cell 640 × 480 detector arrays which were mated to dual-band readout integrated circuits (ROICs) to produce FPAs. The measured 80-K cutoff wavelengths were 5.5 μm for MWIR and 9.4 μm for LWIR, respectively. The FPAs exhibited high pixel operabilities in each band, with noise equivalent differential temperature (NEDT) operabilities of 99.98% for the MWIR band and 99.6% for the LWIR band demonstrated at 84 K.

The electrical performance of HgCdTe/Si photodiodes is shown not to have a direct relationship with the dislocation density as revealed by defect etching. This has led to an equivalent circuit model to explain the relationship of the dislocation density and the electrical test data. A new (112)B HgCdTe/CdTe/Si and CdTe/Si etch pit density (EPD) etch has been demonstrated. The new etch has been used to look for distinctive features which may be responsible for the poor electrical performance of individual diode pixels. The new etch chemistry also reduces the surface roughness of the etched epilayer and makes EPD determination less problematic. The new (to HgCdTe) technique of electrostatic force microscopy has also been used to analyze the electrical properties of dislocations.

This paper describes molecular-beam epitaxy growth of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) dual-band device structures on large-area (6 cm × 6 cm) CdZnTe substrates. Wafer-level composition and defect mapping techniques were used to investigate the limiting mechanisms in improving the cutoff wavelength (λ c) uniformity and reducing the defect density. Structural quality of epitaxial layers was monitored using etch pit density (EPD) measurements at various depths in the epitaxial layers. Finally, 640 × 480, 20-μm-pixel-pitch dual-band focal-plane arrays (FPAs) were fabricated to demonstrate the overall maturity of growth and fabrication processes of epitaxial layers. The MWIR/LWIR dual-band layers, at optimized growth conditions, show a λ c variation of ±0.15 μm across a 6 cm × 6 cm CdZnTe substrate, a uniform low macrodefect density with an average of 1000 cm−2, and an average EPD of 1.5 × 105 cm−2. FPAs fabricated using these layers show band 1 (MWIR) noise equivalent temperature difference (NETD) operability of 99.94% and band 2 (LWIR) NETD operability of 99.2%, which are among the highest reported to date.

Raytheon has developed a 3rd-Generation FLIR Sensor Engine (3GFSE) for advanced U.S. Army systems. The sensor engine is based around a compact, productized detector-dewar assembly incorporating a 640 x 480 staring dual-band (MW/LWIR) focal plane array (FPA) and a dual-aperture coldshield mechanism. The capability to switch the coldshield aperture and operate at either of two widely-varying f/#s will enable future multi-mode tactical systems to more fully exploit the many operational advantages offered by dual-band FPAs. RVS has previously demonstrated high-performance dual-band MW/LWIR FPAs in 640 x 480 and 1280 x 720 formats with 20 μm pitch. The 3GFSE includes compact electronics that operate the dual-band FPA and variable-aperture mechanism, and perform 14-bit analog-to-digital conversion of the FPA output video. Digital signal processing electronics perform "fixed" two-point non-uniformity correction (NUC) of the video from both bands and optional dynamic scene-based NUC; advanced enhancement processing of the output video is also supported. The dewar-electronics assembly measures approximately 4.75 x 2.25 x 1.75 inches. A compact, high-performance linear cooler and cooler electronics module provide the necessary FPA cooling over a military environmental temperature range. 3GFSE units are currently being assembled and integrated at RVS, with the first units planned for delivery to the US Army.

Long-wavelength infrared (LWIR) HgCdTe p -on- n double-layer heterojunctions (DLHJs) for infrared detector applications have been grown on 100 mm Ge (112) substrates by molecular beam epitaxy (MBE). The objective of this current work was to grow our baseline p -on- n DLHJ detector structure (used earlier on Si substrates) on 100 mm Ge substrates in the 10 μ m to 11 μ m LWIR spectral region, evaluate the material properties, and obtain some preliminary detector performance data. Material characterization techniques included are X-ray rocking curves, etch pit density (EPD) measurements, compositional uniformity determined from Fourier-transform infrared (FTIR) transmission, and doping concentrations determined from secondary-ion mass spectroscopy (SIMS). Detector properties include resistance-area product (RoA), spectral response, and quantum efficiency. Results of LWIR HgCdTe detectors and test structure arrays (TSA) fabricated on both Ge and silicon (Si) substrates are presented and compared. Material properties demonstrated include X-ray full-width of half-maximum (FWHM) as low as 77 arcsec, typical etch pit densities in mid 10 6 cm −2 and wavelength cutoff maximum/minimum variation <2% across the full wafer. Detector characteristics were found to be nearly identical for HgCdTe grown on either Ge or Si substrates.

Raytheon Vision Systems (RVS) is developing two-color and large format single color FPAs fabricated from molecular beam epitaxy (MBE) grown HgCdTe triple layer heterojunction (TLHJ) wafers on CdZnTe substrates and double layer heterojunction (DLHJ) wafers on Si substrates, respectively. MBE material growth development has resulted in scaling TLHJ growth on CdZnTe substrates from 10cm(2) to 50cm(2), long-wavelength infrared (LWIR) DLHJ growth on 4-inch Si substrates and the first demonstration of mid-wavelength infrared (MWIR) DLHJ growth on 6-inch Si substrates with low defect density (< 1000cm(-2)) and excellent uniformity (composition < 0.1%, cut-off wavelength Delta center-edge < 0.1 mu m). Advanced FPA fabrication techniques such as inductively coupled plasma (ICP) etching are being used to achieve high aspect ratio mesa delineation of individual detector elements with benefits to detector performance. Recent two-color detectors with MWIR and LWIR cut-off wavelengths of 5.5 mu m and 10.5 mu m, respectively, exhibit significant improvement in 78K LW performance with > 70% quantum efficiency, diffusion limited reverse bias dark currents below 300pA and RA products (zero field-of-view, +150mV bias) in excess of 1x10(3) Omega cm(2). Two-color 20 mu m unit-cell 1280x720 MWIR/LWIR FPAs with pixel response operability approaching 99% have been produced and high quality simultaneous imaging of the spectral bands has been achieved by mating the FPA to a readout integrated circuit (ROIC) with Time Division Multiplexed Integration (TDMI). Large format mega pixel 20 mu m unit-cell 2048x2048 and 25 mu m unit-cell 2560x512 FPAs have been demonstrated using DLHJ HgCdTe growth on Si substrates in the short wavelength infrared (SWIR) and MWIR spectral range. Recent imaging of 30 mu m unit-cell 256x256 LWIR FPAs with 10.0-10.7 mu m 78K cut-off wavelength and pixel response operability as high as 99.7% show the potential for extending HgCdTe/Si technology to LWIR wavelengths.

High-performance 20-µm unit-cell two-color detectors using an n-p+-n HgCdTe triple-layer heterojunction (TLHJ) device architecture grown by molecular beam epitaxy (MBE) on (211)-oriented CdZnTe substrates with midwavelength (MW) infrared and long wavelength (LW) infrared spectral bands have been demonstrated. Detectors with nominal MW and LW cut-off wavelengths of 5.5 µm and 10.5 µm, respectively, exhibit 78 K LW performance with >70 % quantum efficiency, reverse bias dark currents below 300 pA, and RA products (zero field of view, 150-mV bias) in excess of 1×103 Ωcm2. Temperature-dependent current-voltage (I–V) detector measurements show diffusion-limited LW dark current performance extending to temperatures below 70 K with good operating bias stability (150 mV ± 50 mV). These results reflect the successful implementation of MBE-grown TLHJ detector designs and the introduction of advanced photolithography techniques with inductively coupled plasma (ICP) etching to achieve high aspect ratio mesa delineation of individual detector elements with benefits to detector performance. These detector improvements complement the development of high operability large format 640×480 and 1280×720 two-color HgCdTe infrared focal plane arrays (FPAs) to support third generation forward looking infrared (FLIR) systems.

Raytheon Vision Systems (RVS) has developed and demonstrated the first-ever 1280 x 720 pixel dual-band MW/LWIR focal plane arrays (FPA) to support 3(rd)-Generation tactical IR systems under the U.S. Army's Dual-Band FPA Manufacturing (DBFM) program. The MW/LWIR detector arrays are fabricated from MBE-grown HgCdTe triple-layer heterojunction (TLHJ) wafers. The RVS dual-band FPA architecture provides highly simultaneous temporal detection in the MWIR and LWIR bands using time-division multiplexed integration (TDMI) incorporated into the readout integrated circuit (ROIC). The TDMI ROIC incorporates a high degree of integration and output flexibility, and supports both dual-band and single-band full-frame operating modes, as well as high-speed LWIR "window" operation at 480 Hz frame rate. The ROIC is hybridized to a two-color detector array using a single indium interconnect per pixel, which makes it highly producible for 20 mu m unit cells and exploits mature fabrication processes currently used to produce single-color FPAs. High-quality 1280 x 720 MW/LWIR FPAs have been fabricated and excellent dual-band imagery produced at 60 Hz frame rate. The 1280 x 720 detector arrays for these FPAs have LWIR cutoff wavelengths >= 10.5 mu m at 78K. These FPAs have demonstrated high-sensitivity at 78K with MW NETD values < 20 mK and LW NETD values < 30 mK with f/3.5 apertures. Pixel operability greater than 99.9% has been achieved in the MW band and greater than 98% in the LW band.

Raytheon Vision Systems (RVS) is developing two-color, large-format infrared FPAs to support the US Army's Third Generation FLIR systems**. RVS has produced 640 x 480 two-color FPAs with a 20 mu m pixel pitch. Work is also underway to demonstrate a 1280 x 720 two-color FPA in 2005. The FPA architecture has been designed to achieve nearly simultaneous temporal detection of the spectral bands while being producible for pixel dimensions as small as 20 microns. Raytheon's approach employs a readout integrated circuit (ROIC) with Time Division Multiplexed Integration (TDMI). This ROIC is coupled to bias-selectable two-color detector array with a single contact per pixel. The two-color detector arrays are fabricated from MBE-grown HgCdTe triple layer heterojunction (TLHJ) wafers. The single indium bump design is producible for 20 mu m unit cells and exploits mature fabrication processes that are in production at RVS for Second Generation FPAs. This combination allows for the high temporal and spatial color registration while providing a low-cost, highly producible and robust manufacturing process.High-quality MWIR/LWIR (M/L) 640 x 480 TDMI FPAs with have been produced and imaged from multiple fabrication lots. These FPAs have LWIR cutoffs ranging to 11 mu m at 78K. These 20 mu m pixel FPAs have demonstrated excellent sensitivity and pixel operabilities exceeding 99%. NETDs less than 25 mK at f/5 have been demonstrated for both bands operating simultaneously.

Raytheon Vision Systems (RVS, Goleta, CA) in collaboration with HRL Laboratories (Malibu, CA) is contributing to the maturation and manufacturing readiness of third-generation, dual-color, HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256×256 30-µm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) spectral regions. The FPAs configured for MWIR/MWIR, MWIR/LWIR, and LWIR/LWIR detection are used for target identification, signature recognition, and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all dual-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art, single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single-mesa, single-indium bump, and sequential-mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.

Raytheon Vision Systems (RVS) has invented and demonstrated a new class of advanced focal plane arrays. These Advanced FPAs are sometimes called 3rd Generation or “Next Generation” FPAs because they have integrated onto the FPA the ability to sense multiple IR spectrums, have improved resolution and performance, and conduct image processing on the FPA ROIC. These next generation of FPAs are allowing more functionality and the detection of a more diverse set of data than previously possible with 2nd Gen FPAs. Examples and history of advanced next generation FPAs are reviewed including RVS’s Multispectral, Uncooled, Adaptive Sensors and other advanced sensors.

Raytheon Vision Systems (RVS) in collaboration with HRL Laboratories is contributing to the maturation and manufacturing readiness of third-generation two-color HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256x256 30μm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) spectral regions. FPAs configured for MWIR/MWIR, MWIR/LWIR and LWIR/LWIR detection are used for target identification, signature recognition and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer-heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all two-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single mesa, single indium bump, and sequential mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.

The high-density inductively coupled plasma (ICP) etching technique has been applied to HgCdTe. The HgCdTe etch rate was studied as a function of key process variables commonly used in high-density plasma etching: chamber pressure, direct current (DC) bias, and ICP-source power. Mesa profiles were characterized using scanning electron microscopy (SEM), and the profiles for the process conditions used were found to be compatible with fabrication procedures for HgCdTe infrared focal-plane arrays (FPAs). The etch uniformity was measured to be better than 5% over a diameter of 6-in.

A combination of mechanical experiments and fabrication of very-long-wavelength infrared (VLWIR) HgCdTe-infrared detectors has been used to investigate the interaction between various unit-cell design and dry-etch process variables on final unit-cell dimensions and detector performance. Etch rate, which determines the process time required to achieve a specified etch depth, was found to be a function of both the trench width opening used to delineate an individual detector element in a focal-plane array (FPA) and the mesa profile observed during etching. Current-voltage (I-V) probe data at 78 K demonstrated the successful fabrication of 30 µm unit-cell, VLWIR-HgCdTe diodes with mesa delineation performed by dry etching. The breakdown performance of these diodes is sensitive to trench width and dry-etch process time.

Since its initial synthesis and investigation more than 40 years ago, the HgCdTe alloy semiconductor system has evolved into one of the primary infrared detector materials for high-performance infrared focal-plane arrays (FPA) designed to operate in the 3-5 mum and 8-12 mum spectral ranges of importance for thermal imaging systems. Over the course of the past decade, significant advances have been made in the development of thin-film epitaxial growth techniques, such as molecular-beam epitaxy (MBE), which have enabled the synthesis of IR detector device structures with complex doping and composition profiles. The central role played by in situ sensors for monitoring and control of the MBE growth process are reviewed. The development of MBE HgCdTe growth technology is discussed in three particular device applications: avalanche photodiodes for 1.55 mum photodetection, megapixel FPAs on Si substrates, and multispectral IR detectors.

As the number of bands and the complexity of HgCdTe multicolor structures increases, it is desirable to minimize the lattice mismatch at growth interfaces within the device structure in order to reduce or eliminate mismatch dislocations at these interfaces and potential threading dislocations that can degrade device performance. To achieve this we are investigating the use of Hg 1−x−y Cd x Zn y Te quaternary alloys which have an independently tunable lattice constant and bandgap. Lattice matching in Hg 1−x−y Cd x Zn y Te structures can be achieved using small additions of Zn (y<0.015) to HgCdTe ternary alloys. We have investigated some of the basic properties of Hg 1−x−y Cd x Zn y Te materials with x≈0.31 and 0≤y≤0.015. The quaternary layers were grown on (112)CdZnTe substrates using MBE and the amount of Zn in the layers was determined from calibrated SIMS measurements. As expected, the lattice constant decreased and the bandgap increased as Zn was added to HgCdTe to form Hg 1−x−y Cd x Zn y Te. Hall-effect results for both n-type (In) and p-type (As) Hg 1−x−y Cd x Zn y Te layers were very similar to HgCdTe control samples. We have also utilized x-ray rocking curve measurements with (246) asymmetric reflections as a novel sensitive technique to determine the correct amount of Zn needed to achieve lattice matching at an interface. MWIR/LWIR n-p-n two-color triple-layer heterojunction structures were grown to evaluate the effects of minimizing the lattice mismatch between the widest bandgap p-type collector layer, using Hg 1−x−y Cd x Zn y Te, and the HgCdTe MWIR and LWIR collector layers and compared to structures that did not incorporate the quaternary. Sequential mode two-color detectors were fabricated using a 256 × 256, 30 µm unit cell design. There were several interesting findings. Macro defects predominantly affected the LWIR band (Band 2) operability and had little effect on the MWIR band (Band 1). The incorporation of Hg 1−x−y Cd x Zn y Te p-type collector layers had little effect on MWIR detector performance, but overall the LWIR performance was generally better. These initial detector results indicate that the use of Hg 1−x−y Cd x Zn y Te alloys in multicolor detector structures are potentially promising and should be pursued further.

Progress on achieving reproducible growth of high performance, dual-band IR detector structures in HgCdTe grown by molecular beam epitaxy (MBE) is described. The reproducibility achieved in the MBE growth of n–p–n device structures comprising HgCdTe epitaxial layers with different composition and doping characteristics was evaluated from the run-to-run precision in the alloy composition, dopant concentration and dislocation density. For a series of 25 growth runs, the standard deviation of the alloy composition in the n-type absorbing layer was 0.002; the yield for the in situ n- and p-type doping process was >95%; and the average dislocation density was <5×105cm−2. In situ optical diagnostics, including spectroscopic ellipsometry and an optical absorption flux monitor were used for the real-time determination of the alloy composition and Cd flux during MBE growth of the two-color device structures. Focal plane arrays with 128×128 elements were fabricated for the simultaneous detection of two sub-bands in the MWIR spectrum. Average RoA values exceeding 1×106 and 2×105Ωcm2 were measured at 77K for diodes operating at 4.0 and 4.5μm, respectively, and the quantum efficiency was greater than 70% in each band. These results on MBE growth and device performance demonstrate that HgCdTe MBE technology is poised for the modest-scale production of advanced IR devices.