This paper introduces a prototype of a GaN-FET based 200 W DC-DC converter. Its design has been carried out to evaluate power density (or power dissipation and volume) and ensure minimal electromagnetic interference (EMI) issues that are commonly associated with the high switching frequency converters. To achieve this ANSYS HFSS-SiWave models have been developed to assess noise emissions based on the parasitic elements of PCB layout. Prototypes performance have been evaluated through extensive testing. This work offers insight into the potential of this technology in future physics detectors.

The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. After a half-scale demonstrator (RD53A) and full scale prototypes of the two ASICs (RD53B-ATLAS and RD53B-CMS), largely used by the two communities to characterize 3D and planar sensors, RD53 developed and submitted to foundry in 2023 the production chips. A general overview of the chip architecture will be described.

The RD53A read-out chip (65 nm CMOS) is a large-scale demonstrator for ATLAS and CMS phase 2 pixel upgrades. It is one of the key elements of the serial powering scheme for the next generation of pixel detectors. The susceptibility of the RD53A chip with respect to external EM noise has an impact on the integration strategies (grounding and shielding schemes) and operating conditions of future Pixel detectors. This paper presents a detailed analysis of the RD53A chip susceptibility to RF conducted disturbances in order to understand and address noise issues of RD53A Chip before the pixel upgrade installation.

The new Pixel Vertex Detector (PXD) used in the upgrade of the high energy physics experiment Belle II is based on the DEPFET technology. Since the PXD is 2 mm far from the beam pipe, the effects of radiated interferences may be taken into account. Though the EM wave associated to the beam is very well confined (skin depth), the beam pipe is grounded to the accelerator and it may have noise currents on its external face due to pumps, auxiliary electronics, power converters, etc. which may produce radiated noise (H field). This analysis is part of the EMC approach that covers the analysis of the emissions and immunity characteristics, as well as the coupling phenomena and grounding issues to define the susceptibility levels required to ensure the successful integration of the detector and, specifically, to achieve the designed performance of the front-end electronics.

This paper shows the impact of the fabrication process in the variation of per unit length electrical parameters of a power cable. For that purpose, a model of the cable based on ANSYS-EM has been developed in order to estimate the value of the L, C and R matrices for different geometries based on uncertainties of the fabrication process. These values have been validated with real measurements. The main goal of this work is to study the effect of the tolerances in the geometry of the cable during the fabrication process.

Serial powering is the baseline choice for low mass power distribution for the CMS and ATLAS HL-LHC pixel detectors. The RD53A prototype chip (65 nm CMOS) integrates 2 shunt-LDO (SLDO) regulators that allow providing constant voltage to each power domain (analog and digital) within a serial power chain with constant current. This paper presents a detailed analysis based on simulations and measurements of the RD53A chip behavior at system level. SLDO performance and system transient behavior (start-up, load changes, parasitic components implications).

New topologies of electric car use high power switching devices which must be integrated with a growing range of electronic systems in small places. A good performance of the car relies on the electromagnetic compatibility among these systems, which requires the characterization of the noise and interferences present in the system. To characterize the noise, both emission and susceptibility issues as well as coupling mechanisms must be studied. This paper presents the work performed for the electromagnetic mapping of a four-wheel fully electric car, which involves both simulation and experimental measurements. It has been carried out within the E-VECTOORCproject (FP7-INFSO-284708), in collaboration with car manufacturers such as Jaguar Land Rover and Skoda.

The vertex detector used in the upgrade of High-Energy physics experiment Belle II includes DEPFET pixel detector (PXD) technology. In this complex topology the power supply units and the front-end electronics are connected through a PXD power cable bundle which may propagate the output noise from the power supplies to the vertex area. This paper presents a study of the propagation of noise caused by power converters in the PXD cable bundle based on Multi-conductor Transmission Line (MTL) theory. The work exposes the effect of the complex cable topology and shield connections on the noise propagation, which has an impact on the requirements of the power supplies. This analysis is part of the electromagnetic compatibility based design focused on functional safety to define the shield connections and power supply specifications required to ensure the successful integration of the detector and, specifically, to achieve the designed performance of the front-end electronics.

High-energy physics experiments are supplied by thousands of power supply units placed in distant areas from the front-end electronics. The power supply units and the front-end electronics are connected through long power cables that propagate the output noise from the power supplies to the detector. This paper addresses the effect of long cables on the noise propagation and the impact that those cables have on the conducted emission levels required for the power supplies and the selection of EMI filters for the front-end electronic low-voltage input. This analysis is part of the electromagnetic compatibility based design focused on functional safety to define the type of cable, shield connections, EMI filters and power supply specifications required to ensure the successful integration of the detector and, specifically, to achieve the designed performance of the front-end electronics.

During the last years, the large hadron collider (LHC), the most powerful particle accelerator in the world, has been running at CERN in Geneva, Switzerland. It includes four large high-energy experiments and the compact muon solenoid (CMS) is one of them. The electronic read-out for the CMS experiment is designed to process signals in the range of $\mu$A-mA and digitize them synchronously at 40 MHz. Parts of these electronic systems are located inside of a uniform magnetic field of 4 T and operate under particle radiation. These characteristics have forced us to analyze, propose, and conduct electromagnetic compatibility (EMC) tests on the electronic equipment before integrating it into the detector. This paper presents the description and analysis of the first EMC plan and tests that were applied to a high-energy physics experiment before the installation and commissioning of the electronics system.

The upgrade of the Belle II experiment plans to use a vertex detector based on two different technologies, DEPFET pixel (PXD) technology and double side silicon microstrip (SVD) technology. The vertex electronics are characterized by the topology of SVD bias that forces to design a sophisticated grounding because of the floating power scheme. The complex topology of the PXD power cable bundle may introduce some noise inside the vertex area. This paper presents a general overview of the EMC issues present in the vertex system, based on EMC tests on an SVD prototype and a study of noise propagation in the PXD cable bundle based on Multi-conductor transmission line theory.

Silicon detectors have been used in astrophysics satellites and particle detectors for high energy physics (HEP) experiments. For HEP applications, EMC studies have been conducted in silicon detectors to characterize the impact of external noise on the system. They have shown that problems associated with the new generation of silicon detectors are related with interferences generated by the power supplies and auxiliary equipment connected to the device. Characterization of these interferences along with the coupling and their propagation into the susceptible front-end circuits is required for a successful integration of these systems. This paper presents the analysis of the sensitivity curves and coupling mechanisms between the noise and the front-end electronics that have been observed during the characterization of two silicon detector prototypes: the CMS-Silicon tracker detector (CMS-ST) and Silicon Vertex Detector (Belle II-SVD). As a result of these studies, it is possible to identify critical elements in prototypes to take corrective actions in the design and improve the front-end electronics performance.

Electric vehicles are complex systems in which EMC must be approached in a significantly different way to the one in conventional cars. The presence of high power supplies assembled in a very small room together with signalling, control and communications devices brings about new issues related to EM disturbances and noise coupling that must be addressed in order to ensure a good performance of the systems. To achieve this, the understanding of the way noise is generated, propagates and couples within the system is critical so as to improve the immunity of the components and, eventually, the whole car. This paper presents the results of an EMC study focused on the electromagnetic interferences that take place in a fully electric vehicle. The outcome in this work is part of an EMC approach that involves an analysis of the emissions and coupling phenomena that may cause an impact on the system safety and performance. To perform this analysis, a campaign of experimental tests has been carried out on the vehicle. This task has been performed within the E-VECTOORC project (FP7-INFSO-284078), in collaboration with Jaguar Land Rover and řkoda.

EMC issues in electric cars require a significantly different approach to the one in conventional cars due to the new power topologies. As a result, the EMC methodologies in these vehicles are not so much developed as they are for example in the railways case, where compatibility with communications and signaling infrastructure is assessed. This paper presents the results of a EMC study focused on the electromagnetic interferences that take place in a power train system used aboard a fully electrical vehicle. The outcome in this work is part of a EMC approach that covers the analysis of the emissions and immunity characteristics, as well as the coupling phenomena and grounding issues that cause an impact on the system safety and performance. The work herein corresponds to the first stage of the study carried out within the E-VECTOORC project (FP7-INFSO-284078), in collaboration with Jaguar Land Rover and řkoda, whose final step will be the electromagnetic mapping of a complete 4-wheel drive vehicle.

The characterization of electromagnetic noise emissions of DC-DC converters is a critical issue that has been analyzed during the desing phase of CMS tracker upgrade. Previous simulation studies showed important variations in the level of conducted emissions when DC-DC converters are loaded/driven by different impedances and power network topologies. Several tests have been performed on real DC-DC converters to validate the Pspice model and simulation results. This paper presents these test results. Conducted noise emissions at the input and at the output terminals of DC-DC converters has been measured for different types of power and FEE impedances. Special attention has been paid to influence on the common-mode emissions by the carbon fiber material used to build the mechanical structure of the central detector. These study results show important recommendations and criteria to be applied in order to decrease the system noise level when integrating the DC-DC.

The front-end electronics (FEE) noise characterization to electromagnetic interference and the compatibility of the different subsystems are important topics to consider for the LHC calorimeter upgrades. A new power distribution scheme based on switching power converters is under study and will define a noticeable noise source very close to the detector's FEE. Knowledge and experience with both FFE noise and electromagnetic compatibility (EMC) issues from previous detectors are important conditions to guarantee the design goals and the good functionality of the upgraded LHC detectors. This paper shows an overview of the noise susceptibility studies performed in different CMS subdetectors. The impact of different FEE topologies in the final sensitivity to electromagnetic interference of the subsystem is analyzed and design recommendations are presented to increase the EMC of the detectors to the future challenging power distribution topologies.

The characterization of the noise emissions of DC-DC converters at system level is critical to optimize the design of the detector and define rules for the integration strategy. This paper presents the impedance effects on the noise emissions of DC-DC converters at system level. Conducted and radiated noise emissions at the input and at the output from DC-DC converters have been simulated for different types of power network and FEE impedances. System aspects as granularity, stray capacitances of the system and different working conditions of the DC-DC converters are presented too. This study has been carried out using simulation models of noise emissions of DC-DC converters in the real scenario. The results of these studies show important recommendations and criteria to be applied to integrate the DC-DC converters and decrease the system noise level.