Active matrix flat-panel imager (AMFPI) technology is being employed for an increasing variety of imaging applications. An important element in the adoption of this technology has been significant ongoing improvements in optical signal collection achieved through innovations in indirect detection array pixel design. Such improvements have a particularly beneficial effect on performance in applications involving low exposures and/or high spatial frequencies, where detective quantum efficiency is strongly reduced due to the relatively high level of additive electronic noise compared to signal levels of AMFPI devices. In this article, an examination of various signal properties, as determined through measurements and calculations related to novel array designs, is reported in the context of the evolution of AMFPI pixel design. For these studies, dark, optical, and radiation signal measurements were performed on prototype imagers incorporating a variety of increasingly sophisticated array designs, with pixel pitches ranging from 75 to 127 microm. For each design, detailed measurements of fundamental pixel-level properties conducted under radiographic and fluoroscopic operating conditions are reported and the results are compared. A series of 127 microm pitch arrays employing discrete photodiodes culminated in a novel design providing an optical fill factor of approximately 80% (thereby assuring improved x-ray sensitivity), and demonstrating low dark current, very low charge trapping and charge release, and a large range of linear signal response. In two of the designs having 75 and 90 microm pitches, a novel continuous photodiode structure was found to provide fill factors that approach the theoretical maximum of 100%. Both sets of novel designs achieved large fill factors by employing architectures in which some, or all of the photodiode structure was elevated above the plane of the pixel addressing transistor. Generally, enhancement of the fill factor in either discrete or continuous photodiode arrays was observed to result in no degradation in MTF due to charge sharing between pixels. While the continuous designs exhibited relatively high levels of charge trapping and release, as well as shorter ranges of linearity, it is possible that these behaviors can be addressed through further refinements to pixel design. Both the continuous and the most recent discrete photodiode designs accommodate more sophisticated pixel circuitry than is present on conventional AMFPIs--such as a pixel clamp circuit, which is demonstrated to limit signal saturation under conditions corresponding to high exposures. It is anticipated that photodiode structures such as the ones reported in this study will enable the development of even more complex pixel circuitry, such as pixel-level amplifiers, that will lead to further significant improvements in imager performance.

The integration of high voltage thin film transistors with a released MEMS process onto the same substrate is demonstrated. High voltage transistors capable of 800V actuation voltage are used to actuate released metal cantilevers and membranes with a low temperature fabrication process (<350°C) on glass substrates. This demonstration is an important step towards realizing MEMS arrays with integrated addressable drivers for applications which require high voltage, such as electrostatic MEMS devices on low temperature substrates (e.g. glass or flex). High voltage thin film transistors (HVTFT) provide the unique property of easily controlling high voltage (50–800V) using a standard input voltage range (0–20V). To our knowledge, this is the first demonstration of integrated HVTFT actuating released MEMS structures.

SID Symposium Digest of Technical PapersVolume 37, Issue 1 p. 1858-1861 64.2: Full Color 100 dpi AMOLED Displays on Flexible Stainless Steel Substrates Anna Chwang, Corresponding Author Anna Chwang Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618achwang@universaldisplay.comSearch for more papers by this authorRichard Hewitt, Richard Hewitt Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorKen Urbanik, Ken Urbanik Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJeff Silvernail, Jeff Silvernail Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorKamala Rajan, Kamala Rajan Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorMike Hack, Mike Hack Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJulie Brown, Julie Brown Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJeng Ping Lu, Jeng Ping Lu Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorChinwen Shih, Chinwen Shih Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorJackson Ho, Jackson Ho Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorRobert Street, Robert Street Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorTeresa Ramos, Teresa Ramos Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorLorenza Moro, Lorenza Moro Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorNicole Rutherford, Nicole Rutherford Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorKeith Tognoni, Keith Tognoni L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this authorBob Anderson, Bob Anderson L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this authorDave Huffman, Dave Huffman L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this author Anna Chwang, Corresponding Author Anna Chwang Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618achwang@universaldisplay.comSearch for more papers by this authorRichard Hewitt, Richard Hewitt Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorKen Urbanik, Ken Urbanik Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJeff Silvernail, Jeff Silvernail Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorKamala Rajan, Kamala Rajan Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorMike Hack, Mike Hack Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJulie Brown, Julie Brown Universal Display Corporation, 375 Phillips Blvd, Ewing, NJ 08618Search for more papers by this authorJeng Ping Lu, Jeng Ping Lu Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorChinwen Shih, Chinwen Shih Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorJackson Ho, Jackson Ho Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorRobert Street, Robert Street Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304Search for more papers by this authorTeresa Ramos, Teresa Ramos Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorLorenza Moro, Lorenza Moro Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorNicole Rutherford, Nicole Rutherford Vitex Systems, Inc., 3047 Orchard Parkway, San Jose, CA 95314Search for more papers by this authorKeith Tognoni, Keith Tognoni L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this authorBob Anderson, Bob Anderson L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this authorDave Huffman, Dave Huffman L3 Communications, 1355 Bluegrass Lakes Parkway, Alpharetta, GA 30004Search for more papers by this author First published: 05 July 2012 https://doi.org/10.1889/1.2433406Citations: 26AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version 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Learn more.Copy URL Share a linkShare onFacebookTwitterLinkedInRedditWechat Abstract We demonstrate full color, top emission, active matrix OLED displays on flexible stainless steel substrates. The 100 dpi QVGA displays are driven by LTPS TFT backplane with excimer laser annealed poly-Si. To our knowledge this is the world's highest resolution full color flexible AMOLED display on steel foil demonstrated to date. Encapsulation is by a multilayer thin film. Citing Literature Volume37, Issue1June 2006Pages 1858-1861 RelatedInformation

Advanced mobile communication devices require a bright, high information content display in a small, light-weight. low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED (FOLED (TM)) display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies.The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED (PHOLED (TM)) device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications.Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier.Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

Large-area color sensor arrays based on vertically integrated thin-film sensors were realized. The complete color information of each color pixel is detected at the same position of the sensor array without using optical filters. Sensor arrays consist of amorphous silicon thin-film color sensors integrated on top of amorphous silicon readout transistors. The spectral sensitivity of the sensors is controlled by the applied bias voltage. The operating principle of the color sensor arrays and the influence of device design on spectral sensitivity are described. Furthermore, the image quality of the sensor arrays is analyzed by measurements of the line spread function and the modulation transfer function.

OLEDs are an ideal technology for electronic display applications. They are fabricated by depositing very thin films of organic materials at low temperatures (<100°C) to form bright, vivid power efficient self-emissive light producing elements with fast response times that can be grown on a variety of large area substrates such as glass, plastic or metal foil. These properties make OLEDs ideally suited to enable high information content flexible displays. In particular, the application of phosphorescent OLEDs leads to very low power consumption displays – a key requirement for mobile applications. In this paper we outline our progress towards developing low power consumption, active-matrix flexible OLED (FOLED™) displays. Our work is focused on integrating three critical enabling technologies: high efficiency long-lived top emission phosphorescent OLED (PHOLED™) device technology, flexible active-matrix backplanes, and thin film encapsulation.

A new process of surface micromachining has been developed, where amorphous silicon (a-Si) and oxynitride films are used as structural and sacrificial layers on the glass substrate, respectively. Due to glass as the substrate material, the temperatures for all process steps need to be lower than 600°C. Some generic mechanical microstructures such as cantilever beams, bridges, and membranes have been fabricated. The stress changes of a-Si films with annealing temperatures are studied. It is found that the residual stress can be minimized using thermal annealing at 430°C for a few hours. In addition, some process issues such as a-Si film bubbling, the film adhesion of a-Si to the glass substrate, and stiction during structure release are discussed.

We demonstrate the improved reliability of high‐temperature (950°C) processed poly‐Si TFTs passivated in a deuterium plasma ambient. Deuterated TFTs exhibit better resistance to performance degradation under dc stress than hydrogenated TFTs. In particular, VT shift is substantially reduced for deuterated TFTs. Our results indicate that the simple substitution of deuterium gas for hydrogen gas in plasma passivation of poly‐Si TFTs can significantly improve device lifetime.

The conventional approach to military vetronics design uses military components which typically lag their commercial counterparts by a couple of years and are generally limited in functional integration. A new paradigm is now emerging in the US military to leverage the commercial technology investment and technical innovations in PC based hardware and software developments. This paradigm has instigated major semiconductor vendors such as Motorola and Intel to exit the military market and henceforth accentuate the need to be innovative in repackaging commercial . components to operate over extended temperatures. The concept presented in this paper consists of a militarized Pentium based general purpose Single Board Computer (SBC) using commercial components. This design incorporates an open architecture (PCI high speed bus, VMEbus) and expansion through the IEEE P1386.1' PCI Mezzanine Card (PMC) connector for peripherals such as Multimedia, Discrete I/O, MIL-STD-1553B2, Global Positioning Satellite System (GPS), etc. These features will contribute to the realization of the "Tactical Internet" which is an integral part of the US army digitized battlefield initiative. Keywords: digitized battlefield, militarized, COTS, open architecture, PC Compatible, PCI, PMC expansion, VME

Abstract— This paper describes 6.3‐million‐pixel active‐matrix displays in monochrome and color (1.6 million color groups) with a diagonal dimension of 33 cm (13 in.), first discussed by Martin et al. in 1993. These displays have the largest number of pixels of any AMLCDs thus far reported. The monochrome display is intended for office‐automation applications where there is a requirement for electronically controlled image reproduction with characteristics similar to those of a conventional laser print. This display achieves the resolution, luminance, and viewing angle required for these applications through a binary driving scheme.