Introduction: Soft pancreatic texture and small pancreatic duct were well known risk factors of postoperative pancreatic fistula (POPF) after pancreaticoduodenectomy (PD). This study aims to compare the POPF rates and other surgical outcomes of laparoscopic versus robotic pancreaticojejunostomy(PJ) in risky pancreas. Method: Between October 2012 to June 2020, total of 429 cases of minimally invasive PD were performed by three surgeons in three different institutions. Among those patients, 201 patients with soft pancreas and small pancreatic duct less than 3 mm were included based on preoperative image study and the operative record. Propensity score matching analysis was performed. Results: 118 totally laparoscopic PD, 49 totally robotic PD, and 34 hybrid PD (laparoscopic resection and robotic anastomosis) were performed. 69 patients underwent laparoscopic PJ and 69 patients underwent robotic PJ were selected after propensity score matching. Demographics of the patients were comparable. Pancreatic duct diameter was similar in both groups (1.8±0.4 mm vs 1.8±0.5 mm, p=1.00). Operative time was shorter in RPJ group (456.1±83.2 vs 405.1±75.4, p=<0.01). Incidence of clinically relevant POPF greater than grade B was comparable in laparoscopic and robotic PJ group (14.5 % vs 11.6 %, p=0.80). Biochemical leakage, grade B, and grade C pancreatic fistulas were 46.4%, 14.5% and 0.0% in laparoscopic PJ group, respectively, and 31.9%, 11.6% and 0.0% in robotic PJ group. Conclusions: Risk of POPF of laparoscopic or robotic PJ in soft texture and small duct was comparable by experienced surgeons. Robotic approach may be beneficial saving operative time.

Magnetostrictive ice detection sensor detects ice accretions that occur on the surface of the aircraft by measuring the change in frequency according to the amount of ice freezing that grows on the probe surface. In this study, computational approach is used to study and analyze the effects of sensor attachment position on the aspects of freezing that occur on the ice detection sensor probe by changing the wall boundary conditions such as the shape of the face on which the sensor is attached and whether the boundary layer is formed or not.

In our study, the microstructure and reliability of micro-solder bumps of through-silicon-via (TSV) packages were assessed in high temperature storage (HTS) condition with several bump structures. The packages were assembled by molded underfill (MUF) processes, and to test the different resin environments, the MUF conditions were modified. Because HTS requires a long period of time in the formal reliability conditions, the estimation of acceleration factors (AF) is critical for the practical evaluation purpose. Elevated temperature (180 o C) was used as an acceleration condition against the normal condition (150 o C). AF was estimated by measuring the intermetallic (IMC) thickness during HTS. Two main mechanisms for IMC growth were considered in the process of obtaining AF: one is the volume shrinkage during IMC formation and the other is the solder diffusion along the lateral side of under-bump metallurgy (UBM). Based on these, the AF of 180 o C HTS referenced on 150 o C was estimated to be in the range of 5-7. To verify the accuracy of AF, two AF values from the actual failure time and IMC growth were compared (between 180 o C and 200 o C), and there was a good consistency. Assuming the same failure mechanism during HTS for the entire temperature region in this study (125-200 o C), we concluded that AF between 150 o C and 180 o C is also valid. That is, the condition at 180 o C for 145hr can replace the condition at 150 o C for 1008 hr. Neither showed an actual failure, meaning the conditions are safe.

Boronization procedure for Versatile Experiment Spherical Torus (VEST) is developed in order to reduce the oxygen impurity during the Ohmic plasma discharge. Carborane (C2B10H12) powder has been chosen for a safe operation. During the helium glow discharge, the sublimated carborane is diffused into the vacuum vessel, which results in thin boron-containing coatings on the vacuum vessel wall. After the boronization, qualitative changes in visible light intensities of oxygen and boron lines are observed indicating that the water concentration is reduced globally. The quality of discharges is greatly improved: a discharge with less radiative loss is achieved, which leads to a record shot of 0.1 MA plasma current and a nearly doubled pulse length.

Implementations of artificial synapse and neuron are presented by combining the silicon nanowire ionsensitive field-effect transistor (ISFET) and the indium-gallium-zinc-oxide (IGZO) memristor. Chemical and electrical operations of synapse are emulated by the pH sensor operation of ISFET and by the long-term potentiation of IGZO memristor, respectively. The concentration of hydrogen ions in electrolyte is successfully transformed via the voltage-controlled oscillator (VCO)-based neuron into the modulation of synaptic strength, i.e., the current of memristor. Proposed synapse and neuron show the feasibility of emulating the brain-inspired computing along with taking into accounts both chemical and electrical operation of synapse.

The invention relates to methods of operating nonvolatile memory devices and nonvolatile memory devices. A method of operating a nonvolatile memory device includes performing a first memory operation on a first memory block of a plurality of memory blocks and a curing operation on a portion of the first memory block when a status signal indicates a ready state of the nonvolatile memory device during an interval equal to or greater than a reference interval after the first memory operation is completed. The nonvolatile memory device includes the plurality of memory blocks, each memory block including a plurality of vertical strings extending in a vertical direction with respect to a substrate.

We report a new failure phenomenon during flip-chip die attach. After reflow, flip-chip bumps were separated between the Al and Ti layers on the Si die side. This was mainly observed at the Si die corner. Transmission electron microscopy images revealed corrosion of the Al layer at the edge of the solder bump metallization. The corrosion at the metallization edge exhibited a notch shape with high stress concentration factor. The organic substrate had Cu metallization with an organic solderable preservative (OSP) coating layer, where a small amount of Cl ions were detected. A solder bump separation mechanism is suggested based on the reaction between Al and Cl, related to the flow of soldering flux. During reflow, the flux will dissolve the Cl-containing OSP layer and flow up to the Al layer on the Si die side. Then, the Cl-dissolved flux will actively react with Al, forming AlCl3. During cooling, solder bumps at the Si die corner will separate through the location of Al corrosion. This demonstrated that the chemistry of the substrate metallization can affect the thermomechanical reliability of flip-chip solder joints.

Internal Medicine JournalVolume 43, Issue 8 p. 948-950 Letters to the Editor Successful endoscopic ultrasound-guided ethanol ablation of multiple insulinomas accompanied with multiple endocrine neoplasia type 1 M. J. Lee, M. J. Lee Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorC. H. Jung, C. H. Jung Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorJ. E. Jang, J. E. Jang Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorJ. Y. Hwang, J. Y. Hwang Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorD. H. Park, D. H. Park Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorT. S. Park, T. S. Park Department of Internal Medicine, Chonbuk National University Medical School, Seoul, KoreaSearch for more papers by this authorW. J. Lee, W. J. Lee Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this author M. J. Lee, M. J. Lee Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorC. H. Jung, C. H. Jung Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorJ. E. Jang, J. E. Jang Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorJ. Y. Hwang, J. Y. Hwang Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorD. H. Park, D. H. Park Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this authorT. S. Park, T. S. Park Department of Internal Medicine, Chonbuk National University Medical School, Seoul, KoreaSearch for more papers by this authorW. J. Lee, W. J. Lee Department of Internal Medicine, Asan Medical Center, University of Ulsan College of MedicineSearch for more papers by this author First published: 06 August 2013 https://doi.org/10.1111/imj.12208Citations: 16Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat Citing Literature Volume43, Issue8August 2013Pages 948-950 RelatedInformation