christopher jannuzzi合作论文数5p k l yu合作论文数5a z h wang合作论文数4f g uarin合作论文数4y t aur合作论文数4r r doering合作论文数4g baccarani合作论文数4s deleonibus合作论文数4giovanni ghione合作论文数4ru huang合作论文数4
Tianling Ren (任天令)合作论文数School of Integrated Circuits, Tsinghua University;School of Information Science and Technology, Tsinghua University4
Hagen Klauk合作论文数Max Planck Institute for Solid State Research4
Ravi M. Todi合作论文数IBM Microelectronics4
Duane Boning合作论文数Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology4d p verret合作论文数3r jindal合作论文数3SS Iyer合作论文数3mariola piatkiewicz合作论文数3jin cai合作论文数3mikael ostling合作论文数3s fainman合作论文数3j w swart合作论文数3s ikeda合作论文数3h s momose合作论文数3Bin Zhao合作论文数3
Arokia Nathan (阿洛基亚·那桑)合作论文数School of Information Science and Engineering, Shandong University;Darwin College, University of Cambridge3
Jeffrey Welser合作论文数Almaden Research Center, IBM Research3
Luca Selmi合作论文数Dipartimento di Ingegneria Enzo Ferrari, Università degli Studi di Modena e Reggio Emilia;University of Udine3a a g requicha合作论文数2Cs Menoni合作论文数2thinfilm transistors合作论文数2georgia inst合作论文数2Shang Hong合作论文数2john r tower合作论文数2m j deen合作论文数2j j liou合作论文数2D. Verret合作论文数2s ringel合作论文数2m chan合作论文数2a oates合作论文数2s saha合作论文数2Jindal, R.P.合作论文数2
Mehdi Anwar合作论文数2
Mohamed Darwish合作论文数2Jerzy Kanicki合作论文数2Baruch Levush合作论文数2Yuan Taur合作论文数2Joan P. Schwartz合作论文数2
Suzanne E. Mohney合作论文数Department of Materials Science and Engineering and Materials Research Institute, The Pennsylvania State University2
