个人简介
Moises Cases (SM'03) received the B.Sc. degree in electrical engineering from City College of New York, New York, in 1969, the M.Sc. degree in computer engineering from Syracuse University, Syracuse, NY, in 1979, and the M.Sc. degree in electronic engineering from New York University, New York, in 1973,He has 36 years' experience in very large-scale integration chip and package designs, in system-level electrical and package designs, and in complex project and people management. Presently, he is a Distinguished Engineer with IBM System and Technology group and Team Leader for system electrical design and integration of x-series servers. He has received 20 U.S. patents. He is a member of the Greater Austin Hispanic Chamber of Commerce and the Hispanic Austin Leadership group, where he received a certificate of appreciation for his participation in the development of a leadership workshop.,Mr. Cases is a member of Tau Beta Pi, Eta Kappa Nu, and the Society of Hispanic Professional Engineers (SHPE). He was the IBM Executive Representative for Region V. He received the Hispanic in Technology Corporate Award from SHPE in 2006. He is a member of various IEEE Technical Program Committees for Components and Packaging Technology, ECTC, and Electrical Performance of Electronic Packaging (EPEP) groups. He is General Cochairman (representing the industry) of the IEEE EPEP workshop for 2005–2006 and was General Chairman of the 1999 IEEE Systems Packaging Workshop. He has been an Associate Editor for IEEE transactions on advanced packaging since 2002. He also chairs the Electromechanical Working Group for the Infiniband Trade Association. He has published 78 refereed technical papers in numerous IEEE proceedings, journals, and transactions. He has received eight IBM Invention Achievement Awards, 22 IBM Author Recognition Awards, five IBM Innovation and Outstanding Technical Achievement Awards, and 43 IBM Technical Disclosure Bulletin publications.
教育经历
Moises Cases (SM'03) received the B.Sc. degree in electrical engineering from City College of New York, New York, in 1969, the M.Sc. degree in computer engineering from Syracuse University, Syracuse, NY, in 1979, and the M.Sc. degree in electronic engineering from New York University,in 1973
Bhyrav M Mutnury合作论文数Dell EMC75
Daniel N De Araujo合作论文数IBM Corp.;c;IBM Corp.61
n pham合作论文数47
Erdem Matoglu合作论文数40
Madhavan Swaminathan合作论文数School of Materials Science and Engineering, Georgia Institute of Technology;Center for Heterogeneous Integration of Micro Electronic Systems, College of Engineering, The Pennsylvania State University9
Nanju Na合作论文数6
Christian Baks合作论文数3
Samuel Connor合作论文数3
Daniel M. Kuchta合作论文数IBM T. J. Watson Research Center3
Raj Mittra合作论文数Department of Electrical & Computer Science, College of Engineering and Computer Science, University of Central Florida;King Abdulaziz University;RM Associates3
Wenhua Yu合作论文数Electromagnetic Communication Laboratory;Pennsylvania State University2
Robert H. Dennard合作论文数Thomas J. Watson Research Center, IBM Research2
