In this paper, a low-power high-speed fully integrated mixed-signal quadrature demodulator with an embedded multi-gigabit modem in 90 nm CMOS technology is presented. A wide dynamic-range automatic gain control (AGC) is implemented to avoid clipping distortion experienced by the baseband ADCs. By reusing the power detector circuit within the AGC, analog signal processor is introduced to recover OOK modulated signals up to 2.5 Gb/s for an additional power consumption of 7.5 mW. Integrated with ultra-low-power, 3 mW, 3 GS/s, 3-bit ADCs and high-speed digital modem, the system requires neither external synchronization controls nor processing to demodulate BPSK modulated signals up to 3.5 Gb/s and DBPSK modulated signals up to 1.3 Gb/s. The baseband modem incorporates a mixed-signal, timing-recovery loop to sample the symbols at the optimum SNR based on a high-speed Gardner timing-error detector for an additional power consumption of 14 mW. The analog front-end consists of IQ mixers, a 13 GHz QVCO, frequency synthesizers, and a baseband AGC for an overall power consumption of 52 mW. The entire receiver chip occupies an area of 1.275 x 1.19 mm(2). To the best of authors' knowledge, this demonstrates the maximum throughput at the minimum power budget and highest level integration among all published wireless multi-gigabit, multi-mode, mixed-signal CMOS receivers.

In this paper, we present a single chip cross-layer approach for a new class of highly integrated CMOS millimeter wave and sub-THz communication and sensing wireless systems. It is based on the convergence of fully integrated CMOS digital radio and beam former, low power multi-gigabit mixed-signal processing and low cost packaging with embedded antenna. A 60GHz CMOS/PCB portable beam-former solution and highly scalable V-band CMOS 45nm architecture are highlighted as leading edge examples of such an approach, enabling breakthrough power/size reduction as well as multi-gigahertz bandwidth and processing speeds. These single chip millimeter wave and sub-THz system-on-chip solutions are the fundamental enablers for a wide range of communication and sensing applications operating from V-band to W-band and beyond.

In this paper, we present four examples of highly integrated 60 GHz single-chip CMOS 90nm digital radios and phased array solutions. These solutions include for the first time digital-to-analog/analog-to-digital conversion and embedded multi-gigabit mixed signal modem requiring no external processing. This convergence of 60GHz CMOS digital radio, low power multi-gigabit mixed-signal processing and digital signal processing on a single chip offers the lowest energy per bit transmitted wirelessly at multi-gigabit rate to meet the very stringent low-power specifications for battery operated consumer electronic portable devices. Layout and temperature dependent 60GHz CMOS 90nm model development and critical high performance analog and mixed building blocks are presented as fundamental enablers for single chip integration. The designs have been optimized for robustness against process variation and temperature, and verified by measurement results.

In this paper, we present a highly integrated 60 GHz CMOS/PCB single-chip digital phased array solution, embedded in QFN package. This represents a unique opportunity to develop low power 60GHz multi-gigabit radio at a similar cost structure as a Bleutooth® radio, addressing the needs of a multitude of bandwidth hungry wireless multimedia applications such as high definition streaming and massive side-loading. The convergence of 60GHz CMOS digital radio, phased array technology, low power multi-gigabit mixed-signal processing low cost filter, phased array antenna embedded in standard package is discussed. In addition, uncompressed HDMI video streaming is demonstrated for the first time, using a standard battery (AAA) operated compact 60GHz CMOS/PCB QFN based module. These solutions offer the lowest energy per bit transmitted wirelessly at multi-gigabit rate, reported till date, to meet the very stringent low-power specifications for battery operated consumer electronic portable devices.