The invention relates to an antenna arrangement (1) for receiving high-frequency signals, in particular for receiving terrestrially emitted television signals, comprising a lower part (2) and an affixed via a joint upper part (3), wherein in the lower part (2), an electronics part ( 17) and (in the upper part 3) at least one antenna structure (16, 19) and an electrical connection between the at least one antenna structure (16, 19) and (the electronic part 17) is integrated in the joint.

The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low-cost high-density substrate manufacturing technology for 1st-level die assembl ...

The invention relates to a high frequency device, particularly an antenna socket, in which the level is detected at the input. If the level is below a threshold value, is detected at a noise level and not fed the signal present at input to the distribution network. If the level is above the threshold, the signal at the input signal is fed into the distribution network.

The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a low- cost high-density substrate manufacturing technology for 1st- level die assemblies. The cost target of 1€/in 2 had to be obtained by increasing toady's 4x4in 2 panel sizes to panels up to 24x24in 2 . The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments.

The paper describes the results of the EU research project LAP that had the target to develop and to demonstrate a lowcost high-density substrate manufacturing technology for 1level die assemblies. The cost target of 1€/in had to be obtained by increasing toady’s 4x4in panel sizes to panels up to 24x24in. The results focus on RF characterization (integrated antennas up to 83GHz, inductors up a Q value of 50), novel packaging strategies (integration of substrate and package), and cost achievements (approaching the cost target). The technology capabilities have been demonstrated with a 9:4 satellite switch operating up to 2.4GHz and readout electronics for physics experiments. INTRODUCTION High-density substrates have gained more and more interest recently, not only to achieve size reduction required for today’s demanding consumer electronics, but also to provide high-density escape routing as present in chipsize/scale packages (CSPs). The costs of these types of substrates have always appeared to be a showstopper. To overcome this obstacle, in 1998 the EU consortium LAP (Low Cost Large Area Panel Processing of MCM-D Substrates and Packages) has formed to bring down the cost for thin-film substrates from ranges of 25US$/in, nothing uncommon in the 1990s, to the range of 1US$/in (≈ 1€/in). The way to achieve this goal is to increase the manufacturing panel size from actual 4x4in lines using existing semiconductor equipment to panel sizes of 8in diameter, 12x12in, 16x16in, and 24x24in, based on dedicated LAP equipment. * Gloriastrasse 35, 8092 Zurich, Switzerland, scheffler@ife.ee.ethz.ch This paper presents • the LAP processes established during the project by the various partners, • the demonstrators used to verify the technical performance of the LAP processes with emphasis on high-density integration and high-frequency behavior, and • the results of the LAP cost benchmarking. THE LAP CONSORTIUM Companies and universities from eight European countries teamed in the LAP consortium to meet its targets [1]. • tyco electronics EM (former SIEMENS EC division, Munich, Germany): general contractor and responsible for the set-up of a 16x16in line and a telecommunication demonstrator, • Thomson-CSF Microelectronique (TCM, Paris, France, now Thales Microwave), responsible for the set-up of a 12x12in line, • ACREO (merger of the former IMC and IOF, Norrköping, Sweden), responsible for the set-up of a 24x24in line, • Strand Interconnect (Norrköping, Sweden), responsible for the set-up of an 8in wafer line, • Electronics Lab ETH Zurich (Zurich, Switzerland), responsible for technology characterization and cost benchmarking, • NMRC (Cork, Ireland), responsible for reliability characterization, • Hirschmann Rheinmetall (Neckartenzlingen, Germany), providing a communication demonstrator operating up to 2.4GHz,