This scalable processor architecture consists of chained ALUs to minimize the physical distance between dependent instructions, thus mitigating the effect of long on-chip wire delays. Simulation studies demonstrate 1.3-15/spl times/ more instructions per clock than conventional superscalar architectures.
Microprocessor clock frequency has improved by nearly 40% annually over the past decade. This improvement has been provided, in equal measure, by smaller technologies and deeper pipelines. From our study of the SPEC 2000 benchmarks, we find that for a high-performance architecture implemented in 100 nm technology, the optimal clock period is approximately 8 fan-out-of-four (FO4) inverter delays for integer benchmarks, comprised of 6 FO4 of useful work and an overhead of about 2 FO4. The optimal clock period for floating-point benchmarks is 6 FO4. We find these optimal points to be insensitive to latch and clock skew overheads. Our study indicates that further pipelining can at best improve performance of integer programs by a factor of 2 over current designs. At these high clock frequencies it will be difficult to design the instruction issue window to operate in a single cycle. Consequently, we propose and evaluate a high-frequency design called a segmented instruction window.
This paper examines the effect of technology scaling and microarchitectural trends on the rate of soft errors in CMOS memory and logic circuits. We describe and validate an end-to-end model that enables us to compute the soft error rates (SER) for existing and future microprocessor-style designs. The model captures the effects of two important masking phenomena, electrical masking and latching-window masking, which inhibit soft errors in combinational logic. We quantify the SER due to high-energy neutrons in SRAM cells, latches, and logic circuits for feature sizes from 600nm to 50nm and clock periods from 16 to 6 fan-out-of-4 inverter delays. Our model predicts that the SER per chip of logic circuits will increase nine orders of magnitude from 1992 to 2011 and at that point will be comparable to the SER per chip of unprotected memory elements. Our result emphasizes that computer system designers must address the risks of soft errors in logic circuits for future designs.
This paper examines the effect of technology scaling and microarchitectural trends on the rate of soft errors in CMOS memory and logic circuits. We describe and validate an end-to-end model that enables us to compute the soft error rates (SER) for existing and future microprocessor-style designs. The model captures the effects of two important masking phenomena, electrical masking and latching-window masking, which inhibit soft errors in combinational logic. We quantify the SER due to high-energy neutrons in SRAM cells, latches, and logic circuits for feature sizes from 600nm to 50nm and clock periods from 16 to 6 fan-out-of-4 inverter delays. Our model predicts that the SER per chip of logic circuits will increase nine orders of magnitude from 1992 to 2011 and at that point will be comparable to the SER per chip of unprotected memory elements. Our result emphasizes that computer system designers must address the risks of soft errors in logic circuits for future designs.
Abstract CACTI 3 0 is an integrated cache access time, cycle time, area, aspect ratio, and power model By integrating all these models together users can have confidence that tradeoffs between time, power, and area are all based on the same assumptions and hence are mutually consistent CACTI is intended for use by computer architects so they can better understand the performance tradeoffs inherent in different cache sizes and organizations This report details enhancements to CACTI 2 0 that are included in CACTI 3 CACTI 0 includes modeling support for the area and aspect ratio of caches, caches with indepen - dently addressed banks, reduced sense - amp power dissipation, and other improvements to CACTI 2