In all recent missions our forces are faced with various types of asymmetric threads like snipers, IEDs, RPGs or MANPADS. 2nd and 3rd Gen IR technology is a backbone of modern force protection by providing situational awareness and accurate target engagement at day/night. 3rd Gen sensors are developed for thread warning capabilities by use of spectral or spatial information. The progress on a dual-color IR module is discussed in a separate paper [1]. A 1024x256 SWIR array with flexure bearing compressor and pulse tube cold finger provides > 50,000h lifetime for space or airborne hyperspectral imaging in pushbroom geometry with 256 spectral channels for improved change detection and remote sensing of IEDs or chemical agents. Similar concepts are pursued in the LWIR with either spectroscopic imaging or a system of LWIR FPA combined with a cooled tunable Laser to do spectroscopy with stimulated absorption of specific wavelengths. AIM introduced the RangIR sight to match the requirements of sniper teams, AGLs and weapon stations, extending the outstanding optronic performance of the fielded HuntIR with position data of a target by a laser range finder (LRF), a 3 axis digital magnetic compass (DMC) and a ballistic computer for accurate engagement of remote targets. A version with flexure bearing cooler with >30,000h life time is being developed for continuous operation in e.g. gunfire detection systems. This paper gives an overview of AIM's technologies for enhanced force protection.

An infrared camera based on a 256×256 focal plane array (FPA) for the second atmospheric window (3–5 µm) has been realized for the first time with InAs/GaSb short period superlattices (SLs). The SL detector structure with a broken gap type-II band alignment was grown by molecular beam epitaxy on GaSb substrates. Effective bandgap and strain in the superlattice were adjusted by varying the thickness of the InAs and GaSb layers and the controlled formation of InSb-like bonds at the interfaces. The FPAs were processed in a full wafer process using optical lithography, chemical-assisted ion beam etching, and conventional metallization technology. The FPAs were flip-chip bonded using indium solder bumps with a read-out integrated circuit and mounted into an integrated detector cooler assembly. The FPAs with a cut-off wavelength of 5.4 µm exhibit quantum efficiencies of 30% and detectivity values exceeding 10 13 Jones at T=77 K. A noise equivalent temperature difference (NETD) of 11.1 mK was measured for an integration time of 5 ms using f/2 optics. The NETD scales inversely proportional to the square root of the integration time between 5 ms and 1 ms, revealing background limited performance. Excellent thermal images with low NETD values and a very good modulation transfer function demonstrate the high potential of this material system for the fabrication of future thermal imaging systems.

The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functions like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status at AIM on quantum well (QWIP) and antimonide superlattices (SL) detection modules for ground and airborne applications in the high performance range.For spectral selective detection, a QWIP detector combining 3-5 mu m (MWIR) and 8-10 mu m (LWIR) detection in each pixel with coincident integration has been developed in a 384x288x2 format with 40 mu m pitch. Excellent thermal resolution with NETD < 30mK @ F/2, 6.8 ms for both peak wavelengths (4.8 mu m and 8.0 mu m) has been achieved. Thanks to the well established QWIP technology, the pixel outage rates even in these complex structures are below 0.5% in both bands.QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms - a material system with higher quantum efficiency is required to limit integration times to typically 1ms.AIM and IAF selected antimonide based type 11 superlattices (SL) for such kind of applications. The SL technology provides - similar to QWIP's - an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized. IAF and AIM last year managed to realize first most promising SL based detectors. Fully integrated IDCA's with a MWIR SL device with 256x256 pixels in 40 mu m pitch have been integrated and tested. The modules exhibit excellent thermal resolution of NETD < 10mk @ F/2 and 5ms. Product improvement meanwhile allowed to reduce pixel outage rates below 1% i.e. down to a level as required for the military use of such detectors.Presently under development is therefore a dual color MWIR device based on SL technology and the existing 384x288 read out circuit (ROIC) used in the dual band QWIP device. This detector is primarily intended for the use in missile approach warning systems where the dual color capability significantly improves suppression of false alarms.Details of the modules and results of the electrooptical performance will be presented for the different items mentioned above.

Quantum well infrared photodetectors (QWIPs) have gained maturity for large focal plane arrays (FPA) with excellent thermal resolution, low 1/f noise, low fixed-pattern noise, and high pixel operability. Due to their spectrally narrow absorption, QWIPs are particularly suitable for thermal imaging applications involving several atmospheric transmission bands or several colors within the same band. We report on our progress on dual-band QWIP FPAs with pixel-registered, simultaneous integration in both bands. The arrays with 384x288 pixels and 40 μm pitch are based on a photoconductive QWIP for the 3-5 μm regime (MWIR) and a photovoltaic "low-noise" QWIP for 8-12 μm (LWIR). Excellent noise-equivalent temperature differences of only 20.6 mK (LWIR) and 26.7 mK (MWIR) have been achieved at 6.8 ms integration time and f/2 aperture. In addition, we have investigated test devices with different gratings, and discuss their dual-band coupling efficiencies.

We report on the development and status of a dual-band QWIP FPA with 384×288 pixels and 40μm pitch for the 3–5μm (mid-wavelength infrared, MWIR) and 8–12μm (long-wavelength infrared, LWIR) spectral bands. The array is based on a photovoltaic “low-noise” QWIP for the LWIR and a photoconductive QWIP for the MWIR and allows for simultaneous integration of both bands on each pixel. Array histograms indicate a noise-equivalent temperature difference as low as 17mK for the MWIR band and 43mK for the LWIR band at an integration time of 7.6 ms. In addition, we have investigated test devices with different gratings, geometries, and sizes and discuss some tradeoffs for dual-band diffraction gratings.

The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functionalities like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status at AIM on the Mercury Cadmium Telluride (MCT), quantum well (QWIP) and antimonide superlattices (SL) detection modules for ground and airborne applications in the high performance range.For high resolution a 1280x720 MCT device in the 3-5 mum range (MWIR) is presently under development.For spectral selective detection, a QWIP detector combining MWIR and 8-10mum (LWIR) detection in each pixel has been developed in a 384x288x2 format with 40 mum pitch, NETD < 35mK @ F/25 6,8 ms for both peak wavelengths (4.8 mum and 8.0 mum). The device provides synchronous integration of both bands for temporal and spatial coincidence of the events observed.QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms - a material system with higher quantum efficiency is required to limit integration times to typically 1ms. For this case, several companies work on molecular beam epitaxy (MBE) of MCT to have access to double or multi layer structures.AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The SL technology provides - similar to QWIP's - an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized. Just recently, IAF and AIM managed to realize first most promising SL based detectors. Fully integrated IDCA's with a MWIR SL device with 256x256 pixels in 40mum pitch have been integrated and tested. The modules exhibit excellent thermal resolution of NETD<12mk @ F/2 and 5ms. The next step will now be to stabilize the technology and to start the development of a dual color MWIR device based on SL technology and the existing 384x288 read out circuit (ROIC) used in the dual band QWIP device.

A dual-band focal plane array (FPA) for the 8-12 rhom and 3 5 pm atmospheric windows with simultaneous integration in both spectral bands on each pixel is reported. The FPA is based on quantum well infrared photodetectors and comprises 384 x 288 pixels with 40 mum pitch. At 7.6 ms integration time and an f/2 aperture, the FPA achieves excellent thermal resolution with noise-equivalent temperature differences of 17 mK (3-5 mum) and 43 mK (8-12 mum).

To provide solutions for thermal imaging modules including image processing functions like non-uniformity correction and video display three platforms of image processing electronics have been developed to match AIM's family of FPA IR detection modules including MCT, PtSi and QWIP detectors. The detection modules include command and control electronics (CCE) with 14 bit digitization of the sensor output. Different detector data interfaces have been realized to cover various application requirements like a 14 bit parallel interface for short distances, a LVDS serial interface for medium distances and a high speed serial link interface for distances up to 30 m. The image processing boards make use of fast digital signal processors (DSP's) to have a flexible architecture for implementation of algorithms like a scene-based non-uniformity correction. The MVIP electronics is a general board to operate with all detection modules like small and large format devices. The HSVIP board was designed to operate the high-speed and dual-color MCT detection modules with fast data rates up to 80 Mpixels/s while the BPVIP is a low power board to operate only small format detectors. The paper will give an overview of AIM's image processing electronics and their functionality together with the IR detection modules for specific applications.

For applications like missile warning and automatic target recognition, AIM is presently launching its new 3(rd) generation high speed dual-color module. The focal plane array (FPA) is a mercury cadmium telluride (MCT) 192x192 56mum pitch device in a dual-color mid wave (MWIR) design. The module provides spectral selection with temporal and spatial coincidence for both colors using a new AIM proprietary technology. The spectral bands presently selected are 3.4-4 and 4.2-5mum with a full frame rate of 870Hz. Prior to the new devices, a sequential multicolor MCT camera with broadband detector and spectral selection using a rotating filter wheel was developed and evaluated. Results are shown to demonstrate the capabilities of spectral selective detection specifically for clutter and false alarm suppression in missile warning applications. A new algorithm was developed to allow highly sensitive detection of missile plumes without any need for non-uniformity correction for long-term stable operation and maximum dynamic range. An outlook is given on new activities at AIM on dual-band devices. The dual-band approach combining mid wave (MWIR) and long wave (LWIR) detection is specifically useful in automatic target recognition. The application, existing devices and the design goal of the new dual-band device are discussed together with experimental results.

The third generation of infrared detection modules is characterized by advanced functionalities like more pixels (array size⩾640×512), higher frame rates (⩾800 Hz at an array size of 256×256), multicolor or multiband capability, and better thermal resolution. This paper focuses on the present status of such technologies at AIM, based on HgCdTe and quantum well focal plane array detectors.

For 3(rd) Gen applications, AIM is presently launching its new high speed mercury cadmium telluride (MCT) modules. Two configurations are developed: a 256x256 40mum pitch device in a broadband 3.4-5mum design and a 192x192 56mum pitch device in a dual color mid wave (MWIR) design. The dual color device provides spectral selection with temporal and spatial coincidence for both colors using a new AIM proprietary technology. The spectral bands presently selected are 3.4-4 and 4.2-5 mum.In any case, a very high frame rate of 800Hz full frame rate for the broadband and 870Hz for the dual color design are realized. The frame rate is equivalent to a data rate of 80MHz pixel rate. Arbitrary subframes in a step size of 8 pixels can be read out at higher frame rates just limited by the 80MHz pixel rate.The focal plane arrays are integrated in AIM standard dewars with either 1Watt, 1.5Watt or 2Watt split linear coolers to accomplish for various cooldown requirements.The command and control electronics is miniaturized and folds around the dewar for minimum volume and good electromagnetic interference (EMI) and vibration/shock immunity. Each of the 8 analog outputs running at 10MHz has an individual 14 Bit analog to digital converter (ADC). The digital data stream is multiplexed on just 2 high speed serial lines using parallel to serial converters. This allows undisturbed transfer of high resolution data over distances as long as 30m, an optical link, available as an option, provides even wider separation. This feature allows simplified integration in slip ring systems on platforms etc. All DC voltages are derived on board from just 15V supply for improved ground loop immunity.A fast digital signal processor (DSP) based image processing board is available for non uniformity correction, visualization and some extra image analysis applications like calculating ratios of colors etc.The present status of the 2 new modules is presented together with measured data. Results of tests with a sequential multi color MCT camera are shown to demonstrate the capabilities of spectral selective detection. An outlook is given on new activities at AIM on dual band QWIP devices.

Low NETD's, coupled with other improvements in camera design and manufacturing, helps to further enable a new class of very demanding imaging applications in medicine and medical research.. The evolution of QWIP FPA over the past five years, with their low NETD, detector uniformity, and high pixel yield, along with improvements in camera control and processing electronics, represents key technical innovations responsible for the reemergence of medical infrared imaging through the development of a new infrared medical imaging technique called Dynamic Infrared Imaging or DIRI. The QWIP's high thermal and spatial resolution coupled with very fast data acquisition capabilities fill the essential requirements of DIRI. Other features required by DIRI applications are the need for stable operation with drifts in the image below a few mK, which allow longer data collecting time. Longer data collection time provides the camera the capability to detect the functional behavior of the autonomic nervous system which operates on a time scale of 0.1 to 0.2Hz.

AIM has developed a sequential multicolor thermal imager to provide customers with a test system to realize real-time spectral selective thermal imaging. In contrast to existing PC based laboratory units, the system is miniaturized with integrated signal processing like non-uniformity correction and post processing functions such as image subtraction of different colors to allow field tests in military applications like detection of missile plumes or camouflaged targets as well as commercial applications Eke detection of chemical agents, pollution control etc.The detection module used is a 384x288 mercury cadmium telluride (MCT) focal plane array (FPA) available in the mid wave (MWIR) or long wave spectral band (LWIR). A compact command and control electronics (CCE) provides clock and voltage supply for the detector as well as 14 bit deep digital conversion of the analog detector output. A continuos rotating wheel with four facets for filters provides spectral selectivity. The customer can choose between various types of filter characteristics, e.g. a 4.2 mum bandpass filter for CO2 detection in the MWIR band.The rotating wheel can be synchronized to an external source giving the rotation speed, typical 25 I/s. A position sensor generates the four frame start signals for synchronous operation of the detector - 100 Hz framerate for the four frames per rotation. The rotating wheel is exchangeable for different configurations and also plates for a microscanner operation to improve geometrical resolution are available instead of a multicolor operation.AIM's programmable MVIP image processing unit is used for signal processing like non-uniformity correction and controlling the detector parameters. The MVIP allows to output the four subsequent images as four quarters of the video screen to prior to any observation task set the integration time for each color individually for comparable performance in each spectral color and after that also to determine separate NUC coefficients for each filter position. This procedure allows to really evaluate the pay off of spectral selectivity in the IR. The display part of the MVIP allows linear look up tables (LUT) for dynamic reduction as well as histogram equalization for automatic LUT optimization. Parallel to the video output a digital interface is provided for digital recording of the 14 bit corrected detector data.The architecture of the thermal imager with its components is presented in this paper together with some aspects on multicolor thermal imaging.

A high resolution thermal imaging system was developed based on a 384 X 288 mercury cadmium telluride (MCT) mid wave (MWIR) infrared (IR) detection module with a 2 X 2 microscan for improved geometrical resolution. Primary design goal was a long identification range of 3 km and high system performance for adverse weather conditions achieved by a system with small entrance pupil and minimized dimensions to fit for integration in existing apertures of armored vehicles, reconnaissance systems and stabilized platforms. A staring FPA module with its potential for long integration times together with a microscan for improved geometrical resolution provides the answers best fit to these requirements. A robust microscanner was developed to fit for military requirements and integrated with AIM's 384 X 288 MCT MWIR module and data processing. The modules allow for up to 2 ms integration time with 25 Hz frame rate and output a 768 X 576 high resolution CCIR standard image. The video image processing (VIP) provides the calculation power for scene based self learning nonuniformity correction (NUC) algorithms to save calibration sources. This NUC algorithm allows take into account non linear effects for unsurpassed performance in highly dynamic scenes. The detection module and VIP are designed to interface with STN's mature system electronics, used e.g. in hundreds of OPHELIOS thermal camera sets fielded. The system electronics provides a lot of different interface features like double serial control bus (CANBUS) interface, analog and digital outputs as well as different video outputs. The integrated graphic generation part allows to put advanced graphic overlays to the thermal image and also to external video signals via the video input feature. This electronics provides the power supply for the whole thermal imaging system as well as different processor controlled algorithms for field of view or zoom drives, focus drives, athermalization and temperature control of the FLIR. A new zoom lens F/2.0 allows to select field of views from 2 degree to 15 degrees horizontal. This covers a wide area of military and paramilitary applications. The whole camera is miniaturized to fit into existing gunner and commander sights for main battle tanks as well as for infantry fighting vehicles. The overall design is compatible in optical, electrical and mechanical direction with the fielded OPHELIOS cameras and so an easy upgrade for existing fire control, reconnaissance and platform systems. The overall design is made under consideration of mil standard environments and is able to withstand vehicle, airborne and shipborne stress. The presentation gives an overview of the different components of the new camera system. Theoretical range performance data are discussed together with measured NETD, MTF and MRTD data of the unit.

Full video format focal plane array (FPA) modules with up to 640 x 512 for high resolution imaging applications in either mercury cadmium telluride (MCT) mid wave (MWIR) infrared (IR) or platinum silicide (PtSi) and quantum well infrared photodetector (QWIP) technology as low cost alternatives to MCT for high performance IR imaging in the MWIR or long wave spectral band (LWIR) have been presented in several earlier publications. MCT units provide fast frame rates >100Hz together with state of the art thermal resolution NETD <20mK for short snapshot integration times of typically 2ms. PtSi and QWIP modules need longer integration times and are usually operated at frame rates of 30-60Hz to provide thermal resolutions of NETD <80mK for PtSi and NETD <20mK for QWIP, respectively. Presently, 2 new MCT detection modules are under development to provide lower geometrical resolution but much faster frame rates and dual color capability. The modules are specifically useful for missile seeker and ir search and track (IRST) applications where fast frame rates are needed or where dual color capability helps to suppress clutter, detect specific ir signatures or discriminates camouflaged targets. A high speed device with 256x256 pixels in a 40micrometers pitch is designed to provide up to 800Hz full frame rate with pixel rates as high as 80Mpixels/s.

The family of 2 dimensional detection modules at AEG INFRAROT-MODULE GmbH (AIM) based on platinum silicide (PtSi) GaAs/AlGaAs quantum well (QWIP) devices or mercury cadmium telluride (MCT) focal planes for applications in either the 3..5 mu m (MWIR) or 8..10 mu m (LWIR) range was recently extended. Two new devices have been realized in the configurations 640x512 in a 24 mu m pitch for mid and long wave applications using either a MCT photovoltaic (PV) array for the MWIR or a QWIP device for the LWIR, respectively. The existing 256x256 MCT MWIR was redesigned in a new configuration with increased fill factor of >80% for improved NETD performance.The MCT units provide fast full frame rates up to >100Hz for the 640x512 units and 200Hz for the 256x256 units. The modules achieve with short snapshot integration times of typically 1ms excellent thermal resolutions with an average NETD < 25mK for the 640x512 and NETD < 9mK for the 256x256 modules.The QWIP units are operated in either a rolling frame or snapshot integration mode with typical frame rates of 60Hz and reach a thermal resolution NETD < 25mK for full frame integration times.The FPA's are integrated up to modules using AIM's standard dewar cooler and command/control electronics (CCE) family. The package is basically identical to the existing large FPA modules like the PtSi640x486 or the QWIP or MCT 256x256 in 40 mu m pitch and is cooled by AIM's 1W split linear cooler. The CCE of the modules provides the common exclusively digital interface, using 14 Bit analog to digital conversion to provide state of the art correctability, access to highly dynamic scenes without any loss of information and simplified interchangeability of the units.The main features of these modules are summarized together with measured performance data.

The family of two dimensional detection modules at AEG Infrared-Modules GmbH (AIM) based on platinum silicide (PtSi) or mercury cadmium telluride (MCT) focal plane arrays for applications in either the 3..5 micrometer (MWIR) or 8..10 micrometer (LWIR) range was recently extended. Two new MCT devices have been realized in the configurations 384 X 288 elements in a 24 micrometer pitch for mid wave applications and 256 X 256 elements in a 40 micrometer pitch for long wave applications. Also a quantum well infrared photodetector (QWIP) device with 256 X 256 elements for long wave applications was introduced. The MCT devices provide extremely fast frame rates like 2200 Hz with snapshot integration times below 350 microseconds and noise equivalent temperature differences (NETD's) less than 20 mK for the LWIR modules while the QWIP device provides a NETD about 10 mK for a rolling frame integration with 20 ms integration time and 50 Hz frame rate. Besides the thermal resolution given by the NETD also a measurement of the correctability of the devices is introduced which is an important characteristic for the system design. The main features of these modules are summarized together with measured performance data of the new MCT devices. The performance data of the QWIP detection module is discussed in reference 1.

The family of two dimensional detection modules at AEG Infrared-Modules GmbH (AIM) based on platinum silicide (PtSi) or mercury cadmium telluride (MCT) focal plane arrays for applications in either the 3..5 micrometer (MWIR) or 8..10 micrometer (LWIR) range was recently extended. Two new MCT devices have been realized in the configurations 384 X 288 elements in a 24 micrometer pitch for mid wave applications and 256 X 256 elements in a 40 micrometer pitch for long wave applications. Further a quantum well infrared photodetector (QWIP) device with 256 X 256 elements for long wave applications was introduced. The QWIP material was developed by the Fraunhofer Institute for Applied Physics (IAF) in Freiburg, Germany. Details of the QWIP chip will be presented in a separate paper. The MCT devices provide extremely fast frame rates like 200 Hz and reach even for very short snapshot integration below 350 microsecond noise equivalent temperature differences (NETD's) below 20 mK for the LWIR modules. The QWIP devices provide an NETD even below 10 mK with excellent homogeneity for a rolling frame integration with 20 ms integration time and 50 Hz frame rate. Besides the thermal resolution given by the NETD, the correctability of the devices is discussed as a second important characteristic for the system design. Miniaturized driving and readout electronics and image processing boards for non uniformity correction were developed for different applications. The electronics provide a standardized exclusively digital interface with 14 bit deep resolution for high resolution excellent correctability and simplified exchangeability of modules. The design concepts of the AIM detector family and the main features of some new selected modules are summarized together with measured performance data in this paper.

A new family of 2 dimensional detection modules based on GaAs quantum well (QWIP) photoconductors was recently developed by AEG Infrarot-Module GmbH (AIM). The QWIP material was developed by the Fraunhofer Institute for Applied Physics (IAF) in Freiburg, Germany. Details of the QWIP chip will be presented in a separate paper (1). This paper will. concentrate on the features of the QWIP detection module i.e. the integration of this specific focal plane array (FPA) into an integrated detector cooler assembly (IDCA), the driving and readout electronics and the necessary non uniformity correction (NUC) hardware and algorithms for achieving the best performance.The paper shows how the new 256x256 QWIP module is integrated in AIM's modular family of detectors. Measured results are shown for the thermal resolution and the correctability of the device. The results are compared with results of recently developed detection modules based on mercury cadmium telluride (MCT) as discussed in a separate paper 2.The correctability results show, that the full performance of the QWIP module with a thermal resolution as low as NETD < 10mK can only be used in systems by highly sophisticated NUC algorithms. AIM has introduced a new self adaptive algorithm (SAICA) which allows a dynamical optimization of the correction coefficients of high performance detection modules. Features of this algorithm will shortly be discussed.AIM contemporarily develops a new 640x512 QWIP module in cooperation with IAF. The device is available starting mid 1998. Basic features of the new device will be given as an outlook.

A family of 2 dimensional detection modules based on 256x256 and 486x640 platinum silicide (PtSi) focal planes, or 128x128 and 256x256 mercury cadmium tellrrride (MCT) focal planes for applications in either the 3.5 mu m (MWIR) or 8.10 mu m (LWIR) range was recently developed by AIM. A wide variety of applications is covered by the specific features unique for these two material systems(1), The PtSi units provide state of the art correctability with long term stable gain and offset coefficients. The MCT units provide extremely fast frame rates like 400Hz with snapshot integration times as short as 250 mu s and with a thermal resolution NETD < 20mK for e.g. the 128x128 LWIR module.The unique design, idea general. for all of these modules is the exclusively digital interface, using 14 Bit analog to digital conversion to-provide state of the art correctability, access to highly dynamic scenes without any loss of information and simplified exchangeability of the units. Device specific features like bias voltages etc, are identified during the final test and stored in a memory on the driving electronics, This concept allows an easy exchange of IDCA's of the same type without any need for tuning or e.g, the possibility to upgrade a PtSi based unit to an MCT module by just loading the suitable software.Miniaturized digital signal processor (DSP) based image correction units were developed for testing and operating the units with output data rates of up to 16Mpixels/s. These boards provide the ability for freely programmable realtime functions like two point correction and various data manipulations in thermography applications. The main features of these modules are summarized together with measured performance data.