The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functionalities like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status at AIM on the Mercury Cadmium Telluride (MCT), quantum well (QWIP) and antimonide superlattices (SL) detection modules for ground and airborne applications in the high performance range.For high resolution a 1280x720 MCT device in the 3-5 mum range (MWIR) is presently under development.For spectral selective detection, a QWIP detector combining MWIR and 8-10mum (LWIR) detection in each pixel has been developed in a 384x288x2 format with 40 mum pitch, NETD < 35mK @ F/25 6,8 ms for both peak wavelengths (4.8 mum and 8.0 mum). The device provides synchronous integration of both bands for temporal and spatial coincidence of the events observed.QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms - a material system with higher quantum efficiency is required to limit integration times to typically 1ms. For this case, several companies work on molecular beam epitaxy (MBE) of MCT to have access to double or multi layer structures.AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The SL technology provides - similar to QWIP's - an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized. Just recently, IAF and AIM managed to realize first most promising SL based detectors. Fully integrated IDCA's with a MWIR SL device with 256x256 pixels in 40mum pitch have been integrated and tested. The modules exhibit excellent thermal resolution of NETD<12mk @ F/2 and 5ms. The next step will now be to stabilize the technology and to start the development of a dual color MWIR device based on SL technology and the existing 384x288 read out circuit (ROIC) used in the dual band QWIP device.

Full video format focal plane array (FPA) modules with up to 640 x 512 for high resolution imaging applications in either mercury cadmium telluride (MCT) mid wave (MWIR) infrared (IR) or platinum silicide (PtSi) and quantum well infrared photodetector (QWIP) technology as low cost alternatives to MCT for high performance IR imaging in the MWIR or long wave spectral band (LWIR) have been presented in several earlier publications. MCT units provide fast frame rates >100Hz together with state of the art thermal resolution NETD <20mK for short snapshot integration times of typically 2ms. PtSi and QWIP modules need longer integration times and are usually operated at frame rates of 30-60Hz to provide thermal resolutions of NETD <80mK for PtSi and NETD <20mK for QWIP, respectively. Presently, 2 new MCT detection modules are under development to provide lower geometrical resolution but much faster frame rates and dual color capability. The modules are specifically useful for missile seeker and ir search and track (IRST) applications where fast frame rates are needed or where dual color capability helps to suppress clutter, detect specific ir signatures or discriminates camouflaged targets. A high speed device with 256x256 pixels in a 40micrometers pitch is designed to provide up to 800Hz full frame rate with pixel rates as high as 80Mpixels/s.

To meet the demands for high performance infrared imaging systems AIM had developed a family of CMT detector modules with linear focal plane arrays, integrated detector cooler assemblies (IDCA), and command and control electronics (CCE). Common features of these modules are focal plane multiplexers with time delay and integration (TDI) function, pixel deselect, programmable gain for each line, bidirectional scan capability, partitioning and global gain select. The family of IDCA's consists either of single chip focal plane arrays (FPA) directly linked to a read out integrated multiplexer (ROIC) by solder bump technique, or one clip infrared detectors connected to one or more ROIC's using a multichip module (MCM) technique, dewars with optimized thermal heat load, coolers with integrated control electronics, and command and control electronics (CCE). The general design of these modules is outlined. Test results are shown.

The family of 2 dimensional detection modules at AEG INFRAROT-MODULE GmbH (AIM) based on platinum silicide (PtSi) GaAs/AlGaAs quantum well (QWIP) devices or mercury cadmium telluride (MCT) focal planes for applications in either the 3..5 mu m (MWIR) or 8..10 mu m (LWIR) range was recently extended. Two new devices have been realized in the configurations 640x512 in a 24 mu m pitch for mid and long wave applications using either a MCT photovoltaic (PV) array for the MWIR or a QWIP device for the LWIR, respectively. The existing 256x256 MCT MWIR was redesigned in a new configuration with increased fill factor of >80% for improved NETD performance.The MCT units provide fast full frame rates up to >100Hz for the 640x512 units and 200Hz for the 256x256 units. The modules achieve with short snapshot integration times of typically 1ms excellent thermal resolutions with an average NETD < 25mK for the 640x512 and NETD < 9mK for the 256x256 modules.The QWIP units are operated in either a rolling frame or snapshot integration mode with typical frame rates of 60Hz and reach a thermal resolution NETD < 25mK for full frame integration times.The FPA's are integrated up to modules using AIM's standard dewar cooler and command/control electronics (CCE) family. The package is basically identical to the existing large FPA modules like the PtSi640x486 or the QWIP or MCT 256x256 in 40 mu m pitch and is cooled by AIM's 1W split linear cooler. The CCE of the modules provides the common exclusively digital interface, using 14 Bit analog to digital conversion to provide state of the art correctability, access to highly dynamic scenes without any loss of information and simplified interchangeability of the units.The main features of these modules are summarized together with measured performance data.

The family of two dimensional detection modules at AEG Infrared-Modules GmbH (AIM) based on platinum silicide (PtSi) or mercury cadmium telluride (MCT) focal plane arrays for applications in either the 3..5 micrometer (MWIR) or 8..10 micrometer (LWIR) range was recently extended. Two new MCT devices have been realized in the configurations 384 X 288 elements in a 24 micrometer pitch for mid wave applications and 256 X 256 elements in a 40 micrometer pitch for long wave applications. Also a quantum well infrared photodetector (QWIP) device with 256 X 256 elements for long wave applications was introduced. The MCT devices provide extremely fast frame rates like 2200 Hz with snapshot integration times below 350 microseconds and noise equivalent temperature differences (NETD's) less than 20 mK for the LWIR modules while the QWIP device provides a NETD about 10 mK for a rolling frame integration with 20 ms integration time and 50 Hz frame rate. Besides the thermal resolution given by the NETD also a measurement of the correctability of the devices is introduced which is an important characteristic for the system design. The main features of these modules are summarized together with measured performance data of the new MCT devices. The performance data of the QWIP detection module is discussed in reference 1.

AEG has successfully developed a family of PtSi detection modules to cover various applications. The development was performed in a cooperation with Daimler Benz Research and Technology F2M and Telefunken Microelectronic TEMIC EZIS. The modules are designed around 2 staring PtSi focal plane arrays (FPA) having 256 X 256 pixels or 640 X 486 pixels, respectively. Both arrays are identical in their basic features like 24 micrometers pitch, > 60% fillfactor, variable integration time, optional interlaced and non interlaced rolling frame readout, subframe capability and excellent thermal resolution with measured values for the NETD < 70 mK (300 K, 20 ms, F/1.4). The FPA's are integrated either in integrated dewar cooler assemblies with a 1/3 W split linear compressor for the 256 X 256 FPA or a 1 W split linear compressor for the 640 X 486 FPA, respectively, or designed for the use in seeker applications with a Joule Thomson cryocooler (640 X 486 FPA only). The modules are completed by different miniaturized types of electronics, providing all DC and clock supplies to drive the FPA's and providing the customer with either a buffered analog or a 14 Bit resolution digital interface. Digital signal processor (DSP) based image correction units were developed for testing the units. The DSP boards provide the ability for freely programmable real-time functions like 2 point correction or other data manipulations in camera applications. The modules and their key features are reviewed together with their performance data.